New Form-in-place EMI gasket material simplifies assembly and reduces total cost of ownership

With a hardness of just 48 (±5) shore A, CHO-FORM 5547 is especially useful in applications where assembly closure forces are low and can eliminate the need for fasteners or rigid housings. The new material utilises nickel-plated silver (Ni/Ag) particles dispersed in a silicone binder to deliver shielding performance of greater than 70 dB (200 MHz to 10 GHz).

The new material can be placed on narrow housing flanges using the latest FIP dispensing technology. This reduces assembly labour and total cost of ownership and also allows the use of smaller package sizes or increased space for PCBs. Corrosion resistance and good long-term stability are additional important benefits offered by the solvent (VOC) free material.

CHO-FORM 5547 is supplied in a choice of 30cc or 55cc syringes that support rapid prototyping or a 300cc cartridge. It is suitable for use in applications with operating temperature ranges from -50°C to +130°C.