Blakell Europlacer to Exhibit at SIEL 2011

TheXPii-II is a new approach to modular pick-and-place, incorporating technology from Europlacer’s innovative award-winning iineo platform. XPii benefits from low-maintenance linear motors, high-resolution digital cameras and advanced on-head optical component sensing. With these advanced features, users benefit from all of the capabilities of the iineo in a compact space. As an additional benefit, the modularity enables users to size lines to meet growing demands.

XPii-II features two placement heads and uses Europlacer’s proven core features, such as turret head, intelligent feeders and powerful software without compromise. It is equipped with a choice of turret heads and incorporates optical sensors that can detect ― on-the-fly ― the presence of components as small as 01005 and as large as 4 long connectors. XPii- II will accommodate components supplied on tape, strip tape, stick and matrix trays.

The system uses Europlacer’s unique Integrated Intelligence™ and fulfils all possible placement needs in one compact system. It is widely configurable, allowing two versions: eight or 12 nozzles, tape trolleys or feeder trolleys, a matrix tray sequencer and an internal matrix tray. Unlike traditional chip-shooter style machines, XPii-II has no restrictions or limitations on component range.