Pending

The Balver Zinn Group announces that Cobar Solder Products Inc. will introduce a complete SELective soldering package in Booth #314 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.

Single-part meshes and grids for a wide range of applications are proven to be cost effective alternatives to their woven wire mesh counterparts. In the majority of cases they provide superior performance, tailored to the specific application and size and shape requirement. When used in charged applications such as RFI shielding, they offer enhanced conductivity by having no cross-over areas and facilitate far easier electrical termination, by ha...

Nihon Superior Co. Ltd., will introduce the newest addition to its SN100C lead-free solder series, in Booth #310 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.

Kyzen, will feature its new AQUANOX A4638 Advanced Packaging Cleaning Chemistry in Booth #500/501 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.

Aqueous Technologies Corp., will highlight the Trident XLD in Booth #505 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.

Juki Automation Systems, will exhibit its KE-1080 modular placement system and FlexSolder W510 in Booth #309 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.

SEHO North America, Inc. will showcase its SelectiveLine soldering module in Booth #237 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.

SemiSouth Laboratories, Inc., has launched new 1200V/5A diodes in the true, compact DPAK (TO-252) surface mount packaging which provides the necessary creepage distance and does not require a center pin.

3M, has used its continuous innovation and creativity to develop and introduce three new lines of 3M silicone laminating adhesive tapes, giving OEMs and converters the ability to achieve high bond strengths to silicone, one of the hardest to bond surfaces because of its very low surface energy.

Viscom AG, a leading supplier of AOI and AXI inspection systems in the electronics industry, is now working with SILGAL IBERICA S.L. as its new representative for the entire Iberian peninsula. SILGAL will represent Viscom throughout Spain and Portugal. With the company’s expertise in electronics production – from paste print to the soldering and refinement of products – SILGAL also is a competent contact partner where investment in AOI and ...