Pending
Leading Memory Manufacturer Endorses Proteus LRC for Lithography Verification
Synopsys, Inc. today announced the endorsement of Proteus lithography rule check (LRC) at Nanya Technology Corporation, a member of the Formosa Plastics Group and a global leader in advanced memory semiconductors focusing on research and development, design, manufacturing and sales of DRAM products. Industry-leading accuracy is achieved through the combined use of production-proven Proteus compact models and the integrated Sentaurus Lithography r...
ULVAC Develops and Sells 'ENTRONTM-EX2 W300 CVD-Ni/CVD-Co' Film Formation System for the Silicide Process for 3D Devices
ULVAC, Inc. announces that it has developed a new system to enhance its ENTRONTM-EX W300 300mm system series, which has a proven track record at plants mass producing semiconductors worldwide. The newly-developed ENTRONTM-EX2 W300 CVD-Ni/CVD-Co system offers CVD-Ni and CVD-Co processing for 3D devices. Its processing capabilities vastly improve productivity and enable greater investment efficiency.
Cliff Electronics Extends Control Knob Options
CLIFF Electronics announce new introductions to their wide range of control knobs. The new K88 range of space saving skirt-less knobs is suitable for use with rotary switches, potentiometers and encoders. Standard colours available are black and grey with opaque caps available with or without a marker-line - in standard colours of black, white, red, grey, yellow, blue and green. The cost effective Cliff K88 knobs are available to fit 4, 6 and 6.3...
Isolated Forward Converter Integrated Circuits Specified over -55°C to 125°C Junction Temperature Range
Linear Technology has announced the high reliability (MP-grade) version of the LT1952/-1, LTC3900 and LT4430. These devices combine to create a high efficiency (up to 95%) synchronous rectified isolated forward converter that is specified and production tested over a -55°C to 125°C operating junction temperature range.
Conduction-cooling assemblies take the heat out of VPX, VME and CompactPCI boards
Now available from electronics packaging specialist Schroff is a range of conduction-cooling assemblies (CCAs) that have been designed specifically for use in VPX, VME and CompactPCI systems. As well as removing the heat from PCBs where convection alone is insufficient, the CCA devices also provide mechanical support for the boards to enable them to withstand conditions of severe shock or vibration.
Timers increase flexibility while reducing part number count
Finder has announced the introduction of a range of eight modular, 22.5mm wide rail-mounted timers designed to provide a complete range of timing functions, while keeping part number holdings to the absolute minimum. The multi-voltage 83 Series of multi-function and mono-function timers handles 14 different timing functions, with time scales between 0.05 seconds to 10 days and offers either single or double pole variants.
Microchip expands stand-alone Real-Time Clock/Calendar device family
Microchip announces a new family of stand-alone Real-Time Clock/Calendar (RTCC) devices. The MCP795WXX/BXX RTCC devices have a 10 MHz SPI, non-volatile memory and an effective combination of features at a price lower than most competitors’ devices, including those with fewer features. The new devices reduce component counts and costs for applications which include smart-energy products, such as thermostats, power meters and commercial refrige...
Texas Instruments spatial array IC simplifies audio soundstage design for multi-speaker portable products
Texas Instruments Incorporated has introduced an integrated circuit that simplifies the design and programming of spatially-enhanced audio systems for multi-speaker portable products, including laptops, tablets, sound bars and sound docking stations. The National LM48901 quad Class D spatial array is the first in a family of innovative audio ICs that employ distributed sound processing coupled with loudspeaker array technology to produce an immer...
Micronic Mydata opens new possibilities for the electronic packaging industry with groundbreaking LDI solution
Micronic Mydata AB launched a new Laser Direct Imaging solution it says will help manufacturers align to the future production needs of advanced electronics. At the same time as mobile phones, notebooks, PCs and other devices are growing smaller and more powerful, their functionality is becoming increasingly complex. A leap forward in direct imaging technology, the new Micronic Mydata LDI 5s Series will enable IC substrate producers to maintain c...
Count On Tools Inc. Develops New LED Nozzle Series
Count On Tools announces the development of a new series of LED nozzles. Recognizing issues with LED component handling during the pick-and-place process, Count On Tools went back to the drawing board to create a new nozzle approach to overcome the tackiness or stickiness of the LED substrates.