Vishay Releases New TFU Thick Film Flat Chip Fuses in Compact 0603 Chip Size

Featuring the standard RR 1608M metric case size [1.55 mm by .85 mm by .45 mm], the Vishay Beyschlag TFU 0603 fuses are designed to provide secondary overcurrent protection for dc-to-dc converters, battery chargers, and low-voltage power supplies in mobile consumer electronics devices. A highly controlled manufacturing process, combined with Vishay's advanced thick film technology, provides an outstanding long-term stability of fusing characteristics for mobile devices such as cell phones, PDAs, digital still cameras, camcorders, and LCD flat screen displays.

The halogen-free and lead (Pb)-free TFU 0603 devices support lead (Pb)-free soldering and are suitable for processing on automatic SMD assembly systems using wave, reflow, or vapor phase processes. The new fuses feature a coating that protects against electrical, mechanical, and climatic hazards.

Terminations for the new lead (Pb)-free TFU chip fuses are pure tin on nickel plating. The immunity of the plating against tin whisker growth has been proven under extensive testing. The new devices comply with the CEFIC-EECA-EICTA list of legal restrictions on hazardous substances. The TFU Series devices are tested in accordance with the UL 248-14, IEC 60127-4, and IEC 60668 standards and are listed under the UL recognition program of Underwriter Laboratories Inc.