Very small photo-IC output couplers

30th May 2006

Toshiba

ES Admin

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Toshiba Electronics Europe has expanded its TLP7xx family of photocouplers with three new devices that provide totem pole outputs. Supplied in SDIP packaging – making them 50% smaller than previous devices - the new photocouplers are suitable for a variety of applications including CAN bus interfaces, high speed data transfer, and intelligent power module signal isolation.

All of the new photocouplers integrate a GaAlAs infrared LED and a high-gain, high-speed photodetector within a surface mount 6-pin SDIP package measuring just 6.8mm x 4.5mm x 3.6mm. Isolation voltage is rated at 5kVrms (minimum), while the totem pole output stage provides both source and sink driving functionality.

The new Toshiba TLP702 and TLP706 photocouplers are suitable for isolating input control signals to intelligent power modules (IPMs) as well as meeting the requirements of industrial inverters and motor drives. The devices are particularly well suited to industrial CAN applications as well as medium speed (5Mbps) data transfer. The TLP702 provides inverter logic functionality, while the TLP706 is targeted at designs requiring buffer logic. Both devices operate with power supply voltages of 4.5V to 20V and deliver a maximum switching time of 600ns.

The new Toshiba TLP716 photocoupler suits high-speed data transfer, making it ideal for plasma panel displays (PDPs), high-speed interfaces and factory automation equipment. Maximum propagation delay is just 75ns, and typical switching speed is rated at 15MBd. The device operates with a supply voltage of between 4.5V and 5.5V.

The new photocouplers feature an internal shield that provides a guaranteed common-mode transient immunity of 10kV/µs. All of the devices are lead-free (Pb-free) and provide guaranteed performance over a temperature range of -40ºC - 100ºC. As with all other devices in Toshiba’s TLP7xx lineup, the couplers meet international safety approvals.

In addition to the standard parts, wide pin-out versions of the new devices are available for applications requiring creepage distance and clearance of up to 8mm.