Passives

Top 5 passives products in September

29th September 2021
Beatrice O'Flaherty
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Electronic Specifier takes a look at the top passives products to have been released in September.

Bourns announced the expansion of its line of 1210-size automotive grade common mode chip inductors. The new Model SRF3225TABM and SRF3225TAFD common mode chip inductor series offer low radiation and high impedance over a broad frequency range to suppress Electromagnetic

 

Interference coming into or leaving the system.

The new series filters complement Bourns' existing common mode chip inductor portfolio, and support higher data rate two wire bus systems in automotive, industrial and other electronic applications. The two new compact-sized series of Bourns common

 mode inductors are designed with a ferrite core and are bifilar-wound to deliver a shielded construction with superior common mode noise suppression.

 


 AVX's TCO Series high-temperature, automotive-grade polymer chip capacitors from AVX are rated for operating temperatures up to 150°C at category voltage and meet AEC-Q200 Stress Test Qualification for Passive Components requirements.

These ensure stable performance at 85°C, 85% relative humidity, and rated voltage for up to 1,000 hours.

Based on AVX’s field-proven TCQ Series automotive polymer capacitors, the new TCO Series chip capacitors are manufactured in an IATF-16949-certified facility and feature robust J-lead constructions comprised of tantalum anodes, tantalum pentoxide (Ta2O5) dielectrics, and conductive polymer electrodes that exhibit a benign failure mode under recommended use conditions.

The series also exhibits low DCL (0.1CV) and basic reliability of 1% per 1,000 hours at 85°C and rated voltage with 0.1Ω/V series impedance and 60% confidence, and is ideally suited for use in high-temperature, low- and medium-power automotive, industrial, and telecommunications applications.  


Gowada Electronics Corp have introduced a new non-magnetic RF thru-hole (leaded) inductor series – 28MG – has been introduced by Gowanda Electronics. This series is ideal for use in medical imaging equipment and other applications where magnetic materials must be avoided. 

These inductors were featured at Gowanda’s booth during BIOMEDevice in Boston (September 21-22), and will be at MD&M Midwest in Minneapolis (November 3-4).

The 28MG series was designed to address the market need for non-magnetic inductors that could achieve inductance values of up to 18 µH for use in Magnetic Resonance Imaging (MRI) equipment, specific types of X-ray equipment and other applications where the presence of magnetic materials could compromise system performance.

This includes applications in telecommunications, security systems, instrumentation, laboratory analysis equipment, aviation equipment, navigation equipment and electronic test equipment.

The performance range provided by the 60 discrete parts within the 28MG series includes Inductance from 1.2 µH to 18 µH, DCR Ohms from 0.079 to 4.15 and Current Rating mA DC from 315 to 2400. 


Vishay claimed to have released the industry's first Automotive Grade IHLP low profile, high current inductor in the 19 mm by 19 mm by 7 mm 7575 case size.

Offering high temperature operation to +155 °C for under the hood automotive applications, the Vishay Dale IHLP 7575GZ-5A offers up to 30 % lower DCR and up to 35 % higher current ratings than devices in the 6767 case size, at a 50 % lower cost than devices in the 8787 case size.

This AEC-Q200 qualified inductor is optimised for energy storage in DC/DC converters up to 2 MHz and high current filtering applications up to the SRF of the inductor.

With its high operating temperature, the device is designed for filtering and DC/DC conversion in engine and transmission control units, diesel injection drivers, and entertainment / navigation systems, in addition to noise suppression for high current BLDC motors, windshield wipers, power mirrors and seats, HID and LED lighting, and heating and ventilation blowers.


KEMET’s C0G surface-mount capacitors with KONNEKT technology are designed for high-efficiency and high-density power applications. They are in stock at Digi-Key.

The KONNEKT high-density packaging technology uses an innovative transient liquid phase sintering (TLPS) material to create a surface-mount multichip solution for high-density packaging.

By utilising KEMET's robust and proprietary C0G base metal electrode (BME) dielectric system, these capacitors are well suited for power converters, inverters, snubbers, and resonators where high efficiency is a primary concern.

With an operating temperature range up to +125°C, these capacitors can be mounted close to fast-switching semiconductors in high power-density applications, which require minimal cooling.

C0G with KONNEKT technology also exhibits high mechanical robustness compared to other dielectric technologies, allowing the capacitor to be mounted without the use of metal frames.

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