Planar X ceramic-based RF filters for compact performance

The new Planar X Series is part of an overarching initiative that entails the creation of cutting-edge board-level ceramic-based thick film RF filters, designed and tested to support various applications markets.

The small footprint, light weight and surface mountable configuration allow for high-volume pick and place applications and make Planar X Series ideal for SATCOM, Radar and Broadcasting industries.

“Planar X Series complements our broad portfolio of RF and Microwave components with the latest technology in RF filters, offering premium performance in a small package,” said Paul Harris, Sales and Marketing VP at Smiths Interconnect. “The technology has proven reliable in the most demanding environments by building upon years of high reliability as a supplier of quality board level components. The addition of the planar filter technology is a natural progression to our existing RF filter product portfolio and Smiths Interconnect is excited to offer this capability in combination with value-added testing services”.

With the Planar X Series, Smiths Interconnect leverages existing thick film process technology upon various dielectric substrates which are designed for use in high-reliability environments, to provide a cost-effective solution offering:

• Compact size and light weight, resulting in reduced overall system mass in critical space applications.
• Excellent rejection characteristics, providing best in-class RF performance.
• Robust materials, suitable for harsh environment.
• Integration capabilities.