Chip capacitors deliver "highest" capacitance density

5th December 2016

Vishay

Mick Elliott

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Datasheet

A new series of vPolyTan multi-anode polymer surface-mount chip capacitors that delivers increased volumetric efficiency for computing, telecom, and industrial applications has been announced by Vishay Intertechnology. Combining polymer tantalum technology with Vishay's patented multi-array packaging (MAP), the T59 series delivers the industry's highest capacitance density while maintaining best-in-class ESR.

Available in the moulded EE (7343-43) case code, the capacitors released today offer up to 25 % better volumetric efficiency than similar devices, which allows for higher capacitance and voltage ratings.

For example, their capacitance of 150µF at 30V is three times higher in capacitance than the closest competing device. In addition, the advanced packaging of the T59 series ensures ultra-low ESR from 25mΩ to 150mΩ at +25 °C and 100kHz.

The devices offer capacitance from 15µF to 470µF, with capacitance tolerance of ± 20 %, and overvoltage ratings up to 75V. By replacing multiple lower-capacitance devices, T59 series capacitors reduce component counts to save PCB space and lower costs in solid-state drives, networking equipment, and motherboards.

In these products, the capacitors are intended for decoupling, smoothing, filtering, and energy storage applications.

The T59 series features ripple current from 1.3 A to 3.1 A at 100 kHz and an operating temperature range of -55 °C to +105 °C. RoHS-compliant, halogen-free, and Vishay Green, the devices offer both lead (Pb)-free and tin/lead (Sn/Pb) wraparound terminations and are available in tape-and-reel packaging per the EIA-481 standard.

The capacitors are 100 % surge current tested to ensure robust performance in high-inrush-current applications.