Capacitors suit high-density power applications

They are in stock at Digi-Key.

The KONNEKT high-density packaging technology uses an innovative transient liquid phase sintering (TLPS) material to create a surface-mount multichip solution for high-density packaging.

By utilising KEMET's robust and proprietary C0G base metal electrode (BME) dielectric system, these capacitors are well suited for power converters, inverters, snubbers, and resonators where high efficiency is a primary concern.

With an operating temperature range up to +125°C, these capacitors can be mounted close to fast-switching semiconductors in high power-density applications, which require minimal cooling.

C0G with KONNEKT technology also exhibits high mechanical robustness compared to other dielectric technologies, allowing the capacitor to be mounted without the use of metal frames.

The C0G with KONNEKT series complements the KC-LINK with KONNEKT series by offering a wider voltage range and operating temperature range up to +125°C.