Toshiba Electronics launches reinforced insulation photocouplers in low-profile SO6 package

The TLP109 and TLP116A are small outline, ‘mini-flat’ photocouplers supplied in an SO6 surface mount package. This package, which has a board mounting footprint of 4.4mm x 3.6mm, is pin-compatible with conventional MFSOP6 packages. However, at just 2.3mm, the package is 0.5mm thinner.

Each of the new devices consists of a GaAlAs infrared LED optically coupled to a high-gain, high-speed photodetector. Both couplers offer reinforced insulation through clearance and creepage distances of more than 5mm. Isolation voltage is rated at 3750Vrms, while an internal Faraday shield with a thickness of more than 0.4mm ensures a guaranteed common mode transient immunity of ±10kV/µs.

Providing a general-purpose open collector output, the TLP109 has a maximum VCC voltage rating of 30V and a typical data transfer rate of 1Mbps. As a result the photocoupler is ideal for digital logic isolation, line receivers, power supply feedback control, transistor inverters and switching power supplies.

The TLP116A operates from 4.5V to 5.5V and features a high-speed totem pole output delivering typical data transfer rates of 20Mbps. This coupler is particularly suited to high-speed interfaces, factory automation systems and plasma display panels (PDPs).