Single chip LEDs improve thermal performance and reduce cost

Using its proprietary GaN on silicon high voltage technology Plessey has been able to use a single LED die to improve thermal performance, improve far field imaging and dramatically reduce cost over incumbent solutions.

Plessey provides components and solutions across the whole of the lighting value chain. Lighting system designers and specifiers can access its design, build and supply chain expertise from GaN on Silicon blue die all the way up to complete luminaires and fixtures. The PLW7070GA high power LED with multiple junctions integrated in a single chip eliminates shadow effects and provides optimised far-field imaging. Compatible with industry standard secondary optics and operating at input currents from 350mA-3A, 1-15W power, Plessey’s high power LEDs reset the bar for performance in low-cost single chip LEDs for demanding outdoor and commercial lighting applications, and are available in a full range of CCT and CRI options.

Giuliano Cassataro, Plessey Director of Sales, said: “This is an extremely exciting development for Plessey. We now have available the widest possible range of LED products and solutions manufactured here in the UK at the most competitive pricing. The PLW7070 range has been designed using our unique integrated multi-junction die architecture that provides us with a differentiated solution for a diverse range of high power applications in high bay, floodlighting, street lighting, spot lighting and down lighting, in addition to portable torches and lamps. The move for designers to mid-power products because of low cost can now be reversed as we can provide solutions where the overall fixture costs are up to 50% lower. GaN on silicon is really starting to come into his own.”

“The key features and benefits we bring to customers and the LED lighting market with the Plessey 7070 range is a custom aluminium nitride ceramic lensed package with an industry standard solder pattern and footprint. Its low thermal resistance, less than 2°C W-1, combined with a high maximum junction temperature of 135°C for good thermal management in demanding thermal environments is critical in heat management. Using a single GaN/Si multi-junction chip for 12 and 24V operation, Plessey is setting a benchmark for far field imaging and the use of secondary optics in narrow beam angle applications. Superb maintenance of luminous flux is possible over a wide temperature range and the in-built ESD protection provides stable yield through system manufacture and operation.”

Plessey recently announced its innovative high power Orion Beam Forming LED Module in the Stellar family that combines Plessey’s MaGIC low cost, high efficiency, surfacing-emitting LEDs with unique modular optics, delivering compact collimation of light, representing the next phase in LED lighting in directional lighting applications. Plessey's beam forming module solution permits lighting designers to improve the reliability and quality of light by using its state-of-the-art LED light engine for most applications. The Orion has been selected for a number of lighting design awards and will be demonstrated that the upcoming LuxLive event in London on 23^rd to 24^th November 2016.