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Nordson ASYMTEK’s LED Dispensing Applications Highlighted at LED Korea

28th January 2013

Nordson

ES Admin

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Nordson ASYMTEK will demonstrate precision dispensing solutions for LED and semiconductor packaging at LED Korea 2013, booth #4228, Hall B. Applications include phosphor coating for tight CIE LEDs, high-throughput silicone phosphor encapsulation, pure silicone casting, flux, and underfill for flip chip, package-on-package (PoP), chip scale packages (CSP), and ball grid arrays (BGA). Also on display will be Nordson ASYMTEK’s new NexJet Dispensing System with the one-piece Genius Jet Cartridge. The system makes dispensing faster, easier, and smarter.

Nordson ASYMTEK’s Spectrum S-922N-LED work cell offers consistent dispensing volume for high yields in LED encapsulation. The dual simultaneous jets deliver high throughput that benefits high-volume production and achieves a low-cost solution. The system uses patented CPJ™ (Calibrated Process Jetting) for automatically ensuring volumetric repeatability during long production runs.

The LED Industry needs technology to deposit conformal phosphors on die or optics for consistent bin control; however, it is challenging to keep the phosphor dispersion in suspension and uniformly mixed. Nordson ASYMTEK’s Spectrum™ phosphor coating solution meets these challenges. The system includes air management to address safety concerns, a robust interior to minimize damage from phosphor particles, and heated tooling for your specific application.

LED Korea is being held in conjunction with SEMICON Korea, COEX, Seoul, January 30 -February 1, 2013. Stop by the Nordson ASYMTEK booth to discuss your LED or semiconductor packaging challenges.