'Industry’s first' CWDM4 L-PIC for 100G datacentre applications

MACOM’s Etched Facet Technology (EFT) lasers are attached to the Silicon PIC using its proprietary Self-Alignment process (SAEFT™) with high coupling efficiency, offering a power efficient solution at reduced manufacturing cost.

MACOM’s MAOP-L284CN features four high bandwidth Mach-Zehnder modulators integrated with four lasers (1270, 1290, 1310, and 1330 nm) and a CWDM multiplexer, with each channel operating at up to 28 Gb/s. The L-PIC operates on a standard single mode optical fiber and includes integrated tap detectors for fiber alignment, system initialisation and closed loop control. A single fiber aligned to the output edge coupler of this 4.1x6.5mm die is the only optical requirement for implementing this device into QSFP28 transceiver applications. MACOM is also offering the MASC-37053A modulator driver integrated with CDR, matched with this L-PIC for optimised performance and power dissipation.

“Silicon-based photonic integrated circuits, or PICs, enable integration of optical devices such as modulators and multiplexer onto a single chip. We believe that MACOM’s L-PIC solves the key challenge of aligning lasers to the silicon PIC with high yield and high coupling efficiency, making the adoption of Silicon PICs a reality for high-speed optical interconnects within the datacentre,” said Vivek Rajgarhia, Vice President of Strategy, High-Speed Networking, MACOM.

MACOM’s L-PIC will be on display for private demonstrations at OFC 2016, Booth #3101, March 22-24^th in Anaheim, CA. To make an appointment, contact your local sales representative.