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| Discover how AI/ML is revolutionizing sensing technology in embedded applications. This Mouser Electronics in-depth guide explores requirements for AI/ML accelerators, data optimization, and future trends. Don’t miss out! |
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| The rise of renewable energy and electric vehicles is placing unprecedented demands on the electricity grid. A smart charging infrastructure (SCI) is essential to maintain grid stability, improve efficiency, and create new commercial opportunities. In this whitepaper, Infineon explores: What makes a charging infrastructure truly smart and more. |
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| Alex King has been appointed as a new trustee to EngineeringUK. The surveyor at regulator, the Civil Aviation Authority (CAA), Alex oversees aircraft engineering organisations and licensed personnel. He also serves with the CAA’s Shadow Board, is a Governor with a local primary school and a mentor with the Social Mobility Foundation. |
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| GÖPEL has announced future-proof quality assurance for power electronics through sintering paste inspection with multi-line SPI. |
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| According to David Pashley, Co-Founder & Managing Director at Direct Insight, it’s really quite clear for designers of embedded systems, written in black and white in the EU Cyber Resilience Act (CRA): in three years’ time – on December 11th 2027, to be precise – compliance will be mandatory. No compliance, no CE mark – and no shipping to the EU. |
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| Digvijay Kanwar, SVP, India, US, EU & Africa, NEXT Biometrics, discusses takeaways from MOSIP Connect 2025. |
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| If you're searching for a high efficiency 550W fanless power supply that's compact, rugged, and ready for real-world deployment, the Cincon LFM550S and LFM550M series are top contenders. |
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| OKW has added a special new machining service for LED backlighting to its enclosure customisation options – enabling electronics designers to overcome the ingress protection issues associated with fitting LEDs and/or light pipes to a housing’s front panel. |
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| Navitas Semiconductor, the pure-play, next-generation power semiconductor company and industry leader in gallium nitride (GaN) power ICs and silicon carbide (SiC) technology, has announced its GaNSense power ICs will power GreatWall’s latest 2.5kW ultra-high power density DC-DC converter for AI data centres. |
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| Green Hills Software announced the expansion of its products and services for microcontrollers by adding support for the newest Texas Instruments (TI) AM26x high-performance microcontrollers (MCUs) including the AM263x, AM263Px, and AM261x MCU portfolios. |
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