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26th March 2025
Join the World's Largest AI Expo! Register for COMPUTEX 2025!
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COMPUTEX is a premier global exhibition for AIoT and startups, themed "AI NEXT," focusing on AI & Robotics, Next-Gen Technology, and Future Mobility. As a leading platform, it brings together global tech giants to showcasecutting-edge AI technologies. Join us to experience the latest innovations and connect with industry pioneers! 
Latest
26th March 2025
TPSM82823A by Texas Instruments
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The TPSM8282x device family consists of a 1-A, 2-A, and 3-A step-down converter MicroSiP power modules optimized for small solution size and high efficiency. The power modules integrate a synchronous step-down converter and an inductor to simplify design, reduce external components and save PCB area.
Optoelectronics
26th March 2025
Alphawave Semi reveals suite of optoelectronics silicon products
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Alphawave Semi has revealed its portfolio of optoelectronics products addressing the high-speed interconnect semiconductor market, which is forecast to exceed $4 billion by 2028.
Artificial Intelligence
26th March 2025
Rutronik System Solutions develops demo for AI control
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With sense and reason – and a deep understanding of the requirements in the development of innovative applications for relevant future markets. This is how the experts at Rutronik System Solutions are working on the further development of existing base and adapter boards, as well as their integration into application-oriented demonstrations.  
Latest
26th March 2025
TMS320F28P65x Real-Time Microcontrollers
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The TMS320F28P65x (F28P65x) is a member of the C2000 real-time microcontroller family of scalable, ultra-low latency devices designed for efficiency in power electronics, including but not limited to: high power density, high switching frequencies, and supporting the use of IGBT, GaN, and SiC technologies.
Robotics
26th March 2025
China to invest 1 trillion Yuan in robotics and high-tech industries
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China’s National Development and Reform Commission has announced to set up a state-backed venture capital fund focused on robotics, AI, and cutting-edge innovation.
Design
26th March 2025
Non-drip cryogenic epoxy offers electrical and thermal insulation
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Master Bond EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications. The system is electrically non-conductive and thermally insulative, with a thermal conductivity of approximately 0.2 W/(m•K) at room temperature. It withstands cryogenic temperatures and is serviceable in the range from 4K to 250°F.
Artificial Intelligence
26th March 2025
Councils improve services with Tovie AI voice tech
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Tovie AI has completed a voice AI pilot with Richmond & Wandsworth Councils, demonstrating the tangible impact of AI-driven automation on public service efficiency. This project's results prove the effectiveness of AI-powered voice assistants in managing large-scale communications.
Events News
26th March 2025
Qualcomm to deliver keynote at COMPUTEX 2025
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TAITRA (Taiwan External Trade Development Council) has announced that Cristiano Amon, Qualcomm Incorporated President and CEO, is invited to be the speaker at the COMPUTEX 2025 keynote, sharing his vision of the transformative impact of AI on device experiences and ecosystems.
Robotics
26th March 2025
Boston Dynamics and RAI Institute advance humanoid robotics
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Boston Dynamics and the Robotics and AI Institute (RAI Institute) have announced a partnership to push the boundaries of humanoid robotics using reinforcement learning.
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