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| Our engineering contestants have made it to the final round of Circuit Showdown, and they’re ready for their biggest challenge yet! In this episode, they’re tasked with creating their most innovative designs, but just as things seem to be going smoothly, they're presented with an unexpected twist—something every electronic engineer dreads: a last-minute design change. The pressure builds as time ticks down and the stakes rise higher than ever. What will this surprise mean for the competitors? Stay tuned as the challenge unfolds and the competition takes an unexpected turn! Presented by Mouser Electronics and eeDesignIt. Sponsored by Arduino, Renesas, Molex, Keysight, and Vishay. |
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| In an exclusive article for IoT Insider, Gianni Cuozzo, Founder and CEO, Exein poses the question: does the Cyber Resilience Act go far enough? Or could more be done? As the digital landscape evolves, the importance of robust cybersecurity measures cannot be overstated. The Cyber Resilience Act (CRA) represents a significant milestone in the journey…
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| Zachary Amos, Editor of ReHack Magazine focuses on the EU AI Act, its requirements and its security implications As artificial intelligence (AI) has grown, so too have government regulations addressing it. One of the latest and most impactful of these is the European Union’s AI Act. The EU AI Act passed in March 2024, marking…
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| Ellie Gabel, Associate Editor at Revolutionized shares the ways in which IoT technology is helping industries like healthcare and mining The Internet of Things (IoT) has been instrumental in changing numerous industries by increasing visibility. Whether a manufacturing leader wants to learn about critical machine problems before downtime occurs or an agricultural professional needs to…
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| Craig Thomson, Senior Vice President Strategy, Capability and Portfolio at SoftwareOne shares the best practices for Cloud migration. More than half of enterprise IT spending in key market segments will shift to the public Cloud by 2025, according to Gartner. |
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| SECO is happy to announce that samples of the SOM-SMARC-ASL module, a next-generation solution for industrial IoT and AI applications, are now available upon request to those looking to explore its capabilities ahead of full product availability later in Q4 of 2024. The SMARC Rel 2.1 compliant module is equipped with Intel Atom x7000RE Series…
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| Semtech announced expanding its AirVantage Smart Connectivity Advanced solution to include VoLTE services in the US and Europe. VoLTE enables usage across data, SMS and voice services required in applications including healthcare, security and smart city infrastructure. Market intelligence from Transforma Insights projects that approximately 20% of all IoT connections will require voice support by…
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| HUBER+SUHNER has launched a new production line for Low Loss Corrugated (LISCA) cable assemblies, to meet growing demand for 5G connectivity within the UK. The development of the production line, based in Bristol, reflects an expansion to the partnership originally agreed in 2020 and ensures mobile operators have greater accessibility to LISCA cable assemblies for…
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| Mouser is now shipping the new MCX W series microcontrollers (MCUs) from NXP Semiconductors. The MCX W series are compact, secure, wireless MCUs designed to enable interoperable, scalable and innovative designs for the next generation of smart and secure connected devices in edge, IoT, smart home, building automation and controls, and smart energy applications. The…
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| STMicroelectronics has introduced a new bio-sensing chip for the next generations of healthcare wearables like smart watches, sports bands, connected rings, or smart glasses. The ST1VAFE3BX chip combines a high-accuracy biopotential input with ST’s inertial sensing and AI core, which performs activity detection in the chip to ensure faster performance with lower power consumption. “Wearable…
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