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Monday Newsletter
Power
5th August 2024
MagPack technology: Four benefits of new power modules
Find out more
Are you working to double the data rate of your next-generation optical module, but within the existing form factor and power budget? Or are you being asked to cram one more sensor into your machine vision system, but are already out of board space and dissipating too much power?
Webinars
5th August 2024
Exclusive Webinar: Get charged up for the future!
Watch now
Watch Rutronik & Infineon's exciting webinar and discover the power conversion topologies for bidirectional DC charging. In this webinar you will get an overview of the power conversion topologies for bi-directional DC charging and take a closer look at an application example based on Infineon's 50 kW Reference Design.
Cables/Connecting
5th August 2024
High-voltage wire-to-board connector from Hirose
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Hirose has expanded its high-voltage wire-to-board (WTB) connector offering to include a high-heat-resistant version with a space-saving design.
Mixed Signal/Analog
5th August 2024
ROHM develops one of the industry's smallest CMOS op amp
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ROHM has developed an ultra-compact 1.8V - 5V, rail-to-rail CMOS operational amplifier (op amp) - the TLR377GYZ.
Frequency
5th August 2024
Pasternack’s new waveguide fixed attenuators
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Pasternack has announced the launch of a new series of high-performance waveguide fixed attenuators designed specifically for millimetre-wave applications.
Aerospace & Defence
5th August 2024
Littelfuse introduces TVS diode series for avionics
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Littelfuse has announced the release of the new SMBLCE-HR/HRA, SMCLCE-HR/HRA, and SMDLCE-HR/HRA High-Reliability Low Capacitance TVS Diode Series.
Robotics
5th August 2024
An electromagnetic exoskeleton for your hands, powered by Arduino
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The Magnus project, developed by researchers from Tokyo, features a 3D-printed exoskeleton that employs a series of electromagnets mounted onto a rigid frame worn on the user's hand.
Power
5th August 2024
Navitas announces new Gen-3 ‘Fast’ SiC in robust TOLL package
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Navitas Semiconductor has extended its new portfolio of Gen-3 ‘Fast’ (G3F) 650 V SiC MOSFETs into a thermally-enhanced, rugged, high-speed, surface-mount TOLL (Transistor Outline Leadless) package designed for demanding, high-power, high-reliability applications.
News & Analysis
5th August 2024
UK startups raise £10 million through ChipStart programme
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Eleven semiconductor startups focusing on enhancing AI efficiency and developing innovative healthcare technologies have joined a government-supported initiative designed to transform their research into commercial success.
Awards
5th August 2024
Intelliconnect Europe awarded at Farnborough Air Show
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The Farnborough Airshow 2024 proved to be a remarkable event for Intelliconnect (Europe) Ltd and its parent company Trexon, filled with exciting moments, significant recognitions, and valuable networking opportunities. 
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