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Thursday Newsletter
Power
1st August 2024
Breaking the mold: How a new magnetic packaging technology will reshape the future of power modules
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A global team of TIers persisted through challenges to develop the new MagPack packaging technology for power modules, a breakthrough that will help advance the future of power design
Sensors
1st August 2024
Atomic-scale quantum sensor developed
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In a significant scientific breakthrough, an international research team from Germany’s Forschungszentrum Jülich and Korea’s IBS Centre for Quantum Nanoscience (QNS) has created a quantum sensor capable of detecting minute magnetic fields at the atomic scale. 
Power
1st August 2024
Top 5 power products in July
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Electronic Specifier takes a look at the top 5 power products to have been released in July 2024.
Robotics
1st August 2024
Robotics enhance accessibility for patients with paralysis
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A research project funded by Cancer Research UK is set to transform breast screening accessibility for patients with paralysis or other mobility issues.
Latest
1st August 2024
Nordson Electronics Solutions completes Europe location move
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Nordson Electronics Solutions has announced that its Nordson B.V. division, which covers Europe, the Middle East, and Africa, has consolidated its offices into one site in Valkenswaard, The Netherlands, in early July.
Cables/Connecting
1st August 2024
TE Connectivity GEMnet with TI’s FPD-Link IV
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TE Connectivity (TE) has equipped its GEMnet connector system to work with Texas Instruments’ FPD-Link IV SerDes semiconductors to transmit high-resolution, uncompressed video and bidirectional control over lightweight cable assemblies and connectors in the automotive environment with near-zero latency.
Memory
1st August 2024
Weebit Nano and DB HiTek tape-out ReRAM module
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Weebit Nano and DB HiTek have released to manufacturing a demonstration chip integrating Weebit’s embedded Resistive Random-Access Memory (ReRAM) module in DB HiTek’s 130nm Bipolar-CMOS-DMOS (BCD) process.
IoT
1st August 2024
Top 5 IoT products in July
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Electronic Specifier walks through the top 5 IoT products released this July 2024.  
Cables/Connecting
1st August 2024
Floating board-to-board connectors in stock at Anglia
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The FunctionMAX family of connectors from Hirose are Board-to-Board connectors. They are in stock at authorised distributor Anglia Components.
IoT
1st August 2024
Delivering enterprise-grade Linux for Edge-to-Cloud deployments
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The eLxr project has launched its first release of a Debian derivative inheriting intelligent Edge capabilities of Debian, with plans to expand these for a streamlined Edge-to-Cloud deployment approach. eLxr is an open-source, enterprise-grade Linux distribution that addresses the unique challenges of near-Edge networks and workloads.
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