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| TI system-in-package (SIP) processors with integrated LPDDR4 like the AM625SIP help solve common
processor design challenges These processors addresses the hardware, software, robustness, power. and
many more challenges that engineers face today. AM625SIP enables the ability to have a simpler and faster
development flow through the integrated LPDDR4.
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| As a company expands, and so does its IoT applications, the vast data it collects to give insights, could begin to become a blur. Although things like AI can condense and streamline mass quantities of it into actionable insights, understanding the knock on effects remain harder to diagnose, even for an AI model, should relevant…
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| IoT’s promise to revolutionise the way we interact with the world is well underway. Yet, its evolution is underpinned and accelerated by advancements in other key areas: Quantum computing, Cloud technology, 6G, Semiconductor development, and AI to name a few. These technologies are not just shaping the future of IoT but are also critical drivers of innovation across various industries. Therefore, understanding what businesses can expect to see from these is crucial to helping them adapt to the growing opportunities, and challenges, they present. |
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| The EnOcean Alliance, alongside its member companies, is set to have a significant presence at the AHR Expo, scheduled to take place in Chicago from 22nd to 24th January 2024. The event will feature over a dozen EnOcean Alliance member companies showcasing their latest advancements in EnOcean technology. These innovations are focused on smart buildings,…
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| OMNIVISION, a developer of semiconductor solutions, including digital imaging, analogue, and touch & display technology, announced its latest innovation: the OP03050. This is a low-power, compact liquid crystal on silicon (LCOS) panel that combines the LCOS array, driving circuit, frame-buffer, and interface into a single chip. The OP03050 offers a high-resolution, immersive experience, making it…
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| Stellantis has led the development of the world’s first virtual cockpit platform as part of its Stellantis Virtual Engineering Workbench (VEW). This platform significantly accelerates the delivery of infotainment technology to customers, achieving a speed 100 times faster than previous processes. Utilising the QNX Hypervisor in the Cloud from BlackBerry, now available for early access…
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| Ambient Scientific has announced that its first AI System on Chip (SoC) – the GPX10 – is now in volume production. Designed for running AI applications without Cloud dependency on portable, battery-powered devices, the GPX10 is manufactured using TSMC’s 40 nm technology. This product comes equipped with a comprehensive development platform, including a Software Development Kit and Neural Network Compiler, to enable On-Device/IoT AI Applications. The Evaluation kit for GPX10 will be available for commercial purchase starting from Q1 2024. |
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| Dracula Technologies is set to unveil the LAYER Vault at CES in Las Vegas, marking a significant development in energy autonomy for IoT electronics. This innovative technology is a first in its field, seamlessly integrating low-light organic photovoltaic (OPV) energy harvesting with electrical storage on a single flexible film. LAYER Vault offers a sustainable and…
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| Siemens is integrating Amazon Bedrock into its Mendix low-code development platform, facilitating the creation and upgrade of applications with advanced generative AI technology. This move aims to accelerate digitalisation and address skilled labour shortages. Mendix, a leader in low-code development with 50 million end-users and over 200,000 applications running on AWS across various sectors, is…
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| Freight Farms announced that Rick Vanzura, Chief Executive Officer of Freight Farms, and Monalisa Shroff, Chief Financial Officer of Freight Farms, will participate in the 26th Annual ICR Conference, to be held January 8-10, 2024 in Orlando, Florida.
At the Conference, Mr. Vanzura and Ms. Shroff will meet with investors and participate in a fireside chat at approximately 3:00 p.m. Eastern Time on Tuesday, January 9, 2024. A live webcast of the presentation can be accessed and a replay of the webcast will be available for approximately thirty days following the event. |
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