Monday Newsletter

Sponsored 7th November 2022 Fusion’s global service offering has expanded – to serve you better Read more Come try Fusion Worldwide's VR challenge at Electronica booth C2 259. Users will have the opportunity to experience Fusion’s global offices and our expanded worldwide service offerings in a whole new way. It will have you on top of the world!

Sponsored 7th November 2022 Introduction to 1200 V SiC MOSFET Modules for On-Board Charger Applications Read more As the trend in electric vehicle On−Board Charger (OBC) design moves rapidly to higher power and higher switching frequency operation, the demand for SiC MOSFETs for this application is also growing. Many high voltage discrete SiC MOSFETs are already in the marketplace and engineers are designing OBC systems to take advantage of their performance benefits. It is also noted that the changes in the PFC topology are remarkable. Designers are adopting the Bridgeless PFC topology using the SiC MOSFET due to its superior switching performance and small reverse recovery characteristics. In this application note, these modules are introduced, and guidance is provided for employing this new line of modules.

Power 7th November 2022 How eFuse Ensures Integrated FET Operation in Safe Operating Area Read more Applications such as Hot-swap where Power FET is operated in saturation region under high stress, FET safe operating area (SOA) is a major concern for system designers. Designers need to study the FET SOA curve available in the manufacturers data sheet and determine if the FET can handle the power stress without undergoing damage.

Artificial Intelligence 7th November 2022 How AI is reshaping the Edge computing landscape Read more How much computing power is needed at the Edge? How much memory and storage are enough for AI at the Edge?

Power 7th November 2022 The evolution of copper clip power MOSFET packaging {{newsletter_standardPosts4ctaButtonLabel}} The rate of technology innovation is increasing, but one of the revolutions that inspired a shakeup of MOSFET packaging was the fast-evolving computing industry of the 1990s, when one of the areas that saw a seismic shift was in how to improve the performance available from the MOSFET packages.

Sensors 7th November 2022 Leading accuracies in temperature and humidity sensing Read more ScioSense launched the ENS21x family of high-performance digital temperature and humidity sensors.

Design 7th November 2022 Toshiba simplifies motor control with software & hardware ecosystem Read more Toshiba has introduced MCU Motor Studio, bringing together PC-based design tools, microcontroller firmware, and low-cost evaluation hardware to accelerate time to market for motor-control applications hosted on Toshiba TXZ+4A microcontrollers (MCUs).

Passives 7th November 2022 Miniature power inductors added to BEC's "Select" alternative passives Read more Material shortages are badly affecting the availability of SMT Power Inductors. BEC Distribution can now offer quality Alternatives from 5-7 weeks lead time.

Sensors 7th November 2022 Leading accuracies in temperature and humidity sensing Read more ScioSense launched the ENS21x family of high-performance digital temperature and humidity sensors.

Design 7th November 2022 Super-materials of the future could boost UK growth Read more Business Secretary Grant Shapps has announced a £95 million boost to develop the super-materials of the future, supporting research and innovation in advanced materials at the Henry Royce Institute, headquartered in Manchester.

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