|
|
|
|
The piezoresistive silicon pressure sensors offering a digital output for reading pressure over the specified full-scale pressure span (4bar to 12bar | 400kPa to 1.2MPa | 60psi to 175psi) and temperature range (-40°C to +110°C). They are calibrated and temperature compensated for sensor offset, sensitivity, temperature effects, and accuracy errors using an onboard ASIC. |
|
|
|
|
|
|
With more than 20 years of experience developing 802.11a/b/g/n Wi-Fi® devices, let us help you select the optimal Wi-Fi device and develop your next-generation IoT product. Our innovative portfolio includes 2.4-GHz and 5-GHz Wi-Fi system on chips (SoCs), network processors, transceivers and regulatory certified modules. |
|
|
|
|
|
|
Now available through Powell Electronics, the supplier of connectors and more for high-rel applications including defence, aerospace and industrial, are Mach-D high-performance D-Sub connectors from Positronic. Designed for use in harsh environments requiring extreme performance and reliability, the devices are built with precision machined shells that provide superior EMI shielding and robustness. |
|
|
|
|
|
|
HVM Technology have announced the release of their new UMHVP Series, which is a family of low-cost ultra-miniature single-output DC to DC converters supplying up to 5kV in 0.125 cubic inches (0.5” x 0.5” x 0.5”). |
|
|
|
|
|
|
Visevi Robotics offers novel vision-based encoders ViseJoint now for generic angular measurement applications without sensors on the joint. Measurement of one or multiple joints is performed remotely, using a computer vision software and a camera that looks onto the joints from a distance. |
|
|
|
|
|
|
Indium Corporation’s Brian O’Leary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving EV landscape at the SMTA Michigan Expo & Tech Forum at 9am local time, May 17, US. |
|
|
|
|
|
|
Next-generation Wi-Fi 6E provides a foundation for faster, better-performing, lower latency wireless networks at a time when the demands on Wi-Fi networks are exploding. |
|
|
|
|
|
|
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, together with Infineon Technologies, a world leader in semiconductor, microelectronics and IoT solutions, have announced the expansion of their HYPERRAM™ product collaboration with the new higher bandwidth HYPERRAM 3.0. |
|
|
|
|
|
|
A special form of light made using an ancient Namibian gemstone could be the key to new light-based quantum computers, which could solve long-held scientific mysteries, according to new research led by the University of St Andrews. |
|
|
|
|
|
|
Neousys Technology, a provider of rugged embedded systems, announces a new addition to its already-strong edge AI platform, the Nuvo-7168GC. |
|
|
|
|
|
|
|