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| The WFI32E01 with embedded Wi-Fi and advanced security is Microchip’s newest connectivity solution. An all-in-one solution, the WFI32E01 is a high-performance module with integrated MCU in a small form factor. It requires minimal support BOM and is fully certified, saving you time and money in certification costs and time to market. |
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| The TSER953 serializer is part of TI’s V3Link device family designed to support high-speed raw data sensors including 2.3MP imagers at 60-fps and as well as 4MP, 30-fps cameras, satellite RADAR, LIDAR, and Time-of-Flight (ToF) sensors. The device delivers a 4.16-Gbps forward channel and an ultra-low latency, 50-Mbps bidirectional control channel and supports power over a single coax (PoC) or STP cable. |
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| On the 1st September Electronic Specifier will host its Webinar Summit, a one-day event packed with discussions around the latest industry trends in electronics, and the products and technologies that are shaping sectors from automotive to wireless. |
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| Laserfiche has announced the introduction of a Digital Reopening package of prebuilt process templates aimed at supporting organisations’ efforts to restore, recover, reimagine, and rebuild work in a post-pandemic world. |
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| Xilinx has recently introduced the Versal HBM adaptive compute acceleration platform (ACAP), the newest series in the Versal portfolio. |
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| SMART Modular Technologies, announces the introduction of new DDR5 modules that feature enhanced endurance and stability for industrial applications. These new DRAM modules combine the advanced technology of DDR5 with SMART Modular’s unique, rigorous test processes. |
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| 3D semiconductor technologies, MEMS and image sensors will take centre stage 1st-3rd September, 2021, at the SEMI Connecting Heterogeneous Systems Summit as industry experts from across the value chain gather to highlight the latest heterogeneous integration and sensing technology advances that are driving innovation in high-end applications. The virtual event co-locates the SEMI 3D & Systems and MEMS & Imaging Sensors Summits. Registration is open. |
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| The electric vehicle (EV) revolution is leading the automotive industry into a new age. New vehicles will have an electric powertrain option or come as a standard offering, thanks to advances in technology and power generation. Car makers are adding more EVs to their lineups while setting goals for carbon neutrality and bold electrification strategies. Marc Bracken, Technical Marketing Engineer – Automotive Systems Engineering, ON Semiconductor, explains. |
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| Supermicro Computer has announced new versions of its top-loading storage solutions with 60-bay and 90-bay systems along with new Simply Double storage systems fully optimised for the latest 3rd Gen Intel Xeon Scalable processors and PCI-E 4.0NVMe drives. These high-capacity storage and expansion systems are well suited for cloud-scale storage implementations as well as HPC storage workloads. |
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| Toshiba have announced mass production of 12 new motor control microcontrollers (MCUs) in its M4K group of devices. These will be the very first products in the new advanced TXZ+ family. Additionally, Toshiba announced that it will start mass production of a further ten motor control MCUs in their M4M group in July 2021. All of the new devices will be manufactured in a 40nm process, and form part of Toshiba’s TXZ4A+ series. |
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