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Sponsored
18th January 2021
KISSLING Series 29 Sealed Industrial Power Relays
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One-coil monostable industrial relay  IP67/IP6K9K (steam cleaning) sealing technology  Efficient coil and magnetic circuit design with high-quality switching properties
Automotive
18th January 2021
Duo collaborate to accelerate connected vehicle development
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Renesas Electronics has announced its collaboration with Microsoft to accelerate the development of connected vehicles. Renesas’ R-Car Starter Kit, based on Renesas’ R-Car automotive System-on-Chip (SoC), is now available as a development environment for the Microsoft Connected Vehicle Platform (MCVP). MCVP combines a partner ecosystem with a horizontal platform of Azure cloud, AI and edge services on top of which mobility companies can build customer-facing solutions. Renesas has also been certified forAzure IoT Hub and Azure IoT Edge.
Design
18th January 2021
Fibocom L610-EU obtains GCF/CE/NCC certification
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UNISOC, China's CTTL, and Fibocom have announced the successful GCF/CE/NCC certification of the Fibocom L610-EU Cat 1 Module. The Fibocom L610, based on the UNISOC 8910DM, an LTE Cat 1 bis chipset platform, is an industrial-grade LTE Cat 1 module with maximum speeds of up to 10Mbps. GCF certification is a requirement for European operators, who require manufacturers to complete certification before entering the market.
Micros
18th January 2021
Portfolio of low power microcontrollers expanded
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Toshiba Electronics has strengthened its presence in the low power microcontroller market through a greater breadth of product groups within its TXZ+ family. Optimised for motor control systems, domestic appliances, human machine interfaces and connected IoT infrastructure, these highly integrated devices are based on Arm Cortex-M processor cores.
Sponsored
18th January 2021
Maximise efficiency and power density in fast DC EV chargers
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As the number of Electric Vehicles (EVs) increase, there is a high demand for more energy-efficient charging infrastructure systems that can charge vehicles faster than ever before. New EVs have higher ranges and larger battery capacities than their predecessors, necessitating the development of fast DC chargers to support quick charging requirements. Texas Instrument's products and design resources help enable smarter, reliable and more efficient DC charging stations.
Industrial
18th January 2021
The future of tech, as told by CES
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It’s day two of digital CES and the innovations are well underway, with companies big and small from all over introducing their latest developments and breakthroughs to their peers and customers. Among the highlights was a keynote from CTA President and CEO Gary Shapiro and CES Vice President Karen Chupka, find out here what they had to say.
Events News
18th January 2021
CES 2021: The technologies moving us forward
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At last week's virtual Consumer Electronics Show 2021 (CES), Panasonic North America CEO Michael Moskowitz, announced the next generation innovations and emerging technologies that will be driving our society forward through these current challenging times and beyond.
Medical
18th January 2021
Smart hospitals drive digital transformation
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Zyter has announced the launch of Zyter Smart Hospitals, an end-to-end intelligent solution that connects a hospital’s disparate data systems, departments, people, and the latest Internet of Things (IoT) technology devices on Zyter’s robust digital communication and collaboration platform.
Micros
18th January 2021
Secondary side MCU to control primary power enabled
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In modern offline AC/DC power solutions, programmability and adaptive control offer the flexibility and intelligence needed by smart home devices to better interface with their power systems. In these systems, a secondary side MCU is typically not capable of starting a system without the use of a separate bias power supply. A new reference design from Microchip Technology claims to have solved this problem using the MCP1012 high voltage auxiliary AC/DC controller, demonstrating the ability to remove the independent bias power supply in many applications.
Sensors
18th January 2021
Micron pixel smartphone image sensor for selfie cameras
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OmniVision Technologies has announced in advance of CES the OV32B image sensor, featuring a 0.7 micron pixel size to provide 32 megapixel (MP) resolution in a 1/3” optical format. This enables smartphone designers to offer the highest possible front-facing, selfie camera resolution in the limited space available.
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