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Winbond's high-quality Code Storage Flash Memory, Specialty DRAM, and Mobile DRAM are now available on the TECHDesign ecommerce platform. All orders will be delivered directly by Winbond. Large quantities in stock and volume discounts available! |
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Join a global audience of developers, designers, and decision-makers advancing the world of embedded systems applications at NXP's first fully virtual training event: NXP Connects. This 100% digital conference gives you access to more expertise and insight from industry leaders and NXP experts than ever before. Learn how NXP's latest technologies for Automotive, Edge Processing, and Secure Connectivity can help you accelerate your next breakthrough. |
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The LM5156x-Q1 (LM5156-Q1 and LM51561-Q1) device is a wide input range, non-synchronous boost controller that uses peak current mode control. The device can be used in boost, SEPIC, and flyback topologies. |
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u-blox has announced the commercial launch of its IoT Security-as-a-Service offering. Available on both the u-blox SARA-R4 and SARA-R5 series of LTE-M cellular IoT modules, this innovative solution makes it extremely simple to protect data from malicious third parties, both on the device and during transmission from the device to the cloud. Its out-of-the box, simple, secure, and cost effective onboarding process to leading cloud IoT platforms speeds up development, shortening time-to-market. |
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Momentum keeps building for Birmingham Tech Week, running digitally 12th to 16th October, as big-name partners and speakers are formally announced today (6 October 2020) from across the tech, business and political spectrum. |
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Implementing multi-channel system control or signal outputs using Digital-to-Analogue Converters (DACs) in portable and handheld industrial, communications, consumer and medical systems has been difficult to do without significant processor overhead for device configuration during power-up. |
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The digital format of electronica will take place from November 9th to 12th, 2020 with digital product presentations and a comprehensive program of conferences and speeches. The platform also offers an outlook on the future of the electronics industry. During the CEO Round Table, representatives from semiconductor manufacturers such as Infineon, NXP Semiconductors and STMicroelectronics will discuss the current and future developments in the industry. |
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Renesas Electronics Corporation has announced the expansion of its RA6 Series microcontrollers (MCUs) with nine new RA6M4 Group MCUs, increasing the RA Family to 42 MCUs. These 32-bit MCUs boost operating performance up to 200MHz using the Arm Cortex-M33 core based on Armv8-M architecture with Arm TrustZone technology. |
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Lanner has announced the release of the NCA-4220, a 1U 19” rackmount appliance powered by Intel Xeon E, Core i7/i5/i3, Pentium or Celeron CPU (codenamed Coffee Lake).The NCA-4220 features the brand new LGA 1151 socket, up to 32GB of dual-channel DDR4 memory capacity at 2666MHz, comprehensive Intel C246/Q370/H310 series chipset, either eight or six GbE LAN configuration and three pairs of Gen3 bypass. |
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LMI Technologies (LMI) has announced the release of Gocator 2430/2440/2450 blue laser line profile sensors. The latest addition to LMI’s popular 2400 series, these new blue laser models are designed for 3D scanning of shiny metal surfaces in electric vehicle (EV) battery inspection, rail inspection (rail geometry), small to medium-size electronic and automotive parts, and general factory automation applications. |
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