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| Combines the 1.25mm pitch Gecko signal connector system with mixed technology layouts, adding 10A power contacts to the range. The smallest and lightest mixed-layout connector available for high-performance applications, Gecko is the ideal choice when SWaP matters most (increase miniaturization, decrease weight, add or improve power options, and either lower cost or get the best possible value for cost).
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| The world of semiconductors is very dynamic, as it plays a major role in shaping the innovations of the future. This is especially true for a global technology leader like ROHM Semiconductor. Do you want to stay up-to-date with the latest developments in Europe? Subscribe to our newsletter! We are giving away an iPhone 11 Pro Max Space Grey with 256 GB among all new subscribers until 31st October 2020.
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| Renesas Electronics has introduced the P9415-R wireless power receiver with Renesas’ exclusive WattShare technology as the newest member of its wireless power solutions portfolio. The new 15W wireless power receiver enables smartphones, power banks, and portable industrial and medical equipment, to wirelessly charge other mobile devices and accessories that also have wireless charging capabilities.
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| The electric flying car racing series, Airspeeder has announced a landmark technical and strategic partnership with Acronis, software company focusing on cyber protection. The racing series, created by performance electric flying car manufacturer, Alauda will receive technical and commercial support from Acronis. The significance of this partnership will be reflected in the placement of the Acronis brand in a prominent position on Airspeeder’s MK4 racing craft.
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| Distance image sensors measure the distance to an objectper pixel, using an indirect TOF (time-of-flight) method. It is a good sensor for people and object detection, and shape recognition for applications where touchless or labour-saving technology is required.
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| SMART Modular Technologies has announced new higher density 16GB and 32GB NVDIMMs which run at DDR4-3200 high speed bus rates. These products, incorporating Micron advanced DDR4 DRAM technology in combination with SMART’s high-speed PCB designs, significantly improve signal integrity, resulting in broader design margins even at the highest DDR4 bus speeds.
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| SMART Modular Technologies has announced new higher density 16GB and 32GB NVDIMMs which run at DDR4-3200 high speed bus rates. These products, incorporating Micron advanced DDR4 DRAM technology in combination with SMART’s high-speed PCB designs, significantly improve signal integrity, resulting in broader design margins even at the highest DDR4 bus speeds.
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| In early May, the Car Connectivity Consortium (CCC) announced the finalisation and availability of its Digital Key Release 2.0 specification. This framework, endorsed by leading carmakers, smartphone manufacturers and electronics suppliers, creates a standardised Digital Key ecosystem that enables mobile devices to store, authenticate, and share Digital Keys for vehicles in a secure, privacy-preserving way to make sharing your car via smart connected devices easier.
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| New research from Future Facilities has revealed the top thermal challenges and trends facing the automotive industry in 2020. Conducted as a roundtable discussion, the research brings together thermal engineering experts from some of the world’s leading automotive and electronics companies, including automotive supplier Brose and level 4 autonomous vehicle company, AutoX.
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| Yamaha Motor Europe Factory Automation section has announced that it is giving customers extra power to boost the pick-and-place flexibility and productivity of their SCARA and cartesian robots by providing a free software plugin for the Asyril Asycube vibration feeder.
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