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Join Nexperia’s Power Live Event and watch our resident power experts present a series of on-demand demonstration videos across a number of topics in Automotive, Industrial, GaN and Power packaging. Including GaN surface mount package technology and novel Silicon-Germanium rectifiers. Engage with like-minded people in live sessions to discuss common challenges and demands. Pre-register and get your free ticket here.
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Join our webinar to learn how you can easily add computer vision to your machines and applications, training them to interpret and understand the visual world. This webinar will discuss the benefits of using Intel silicone and how Intel can support the developer journey, as well as give an overview of Advantech's Edge AI Acceleration Modules and how they can easily be integrated into your applications.
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Farnell offer their 2020 IoT Trends Report for free! Download the report to get insight into key IoT markets, applications, and technologies. New registrants will receive a 10% discount code for their first order! (Countries eligible: UK, France, Spain, Germany, Poland)
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The mechanical alternative to traditional gap pad or thermal interface material offering superior thermal resistance. Suitable for 5G/Wireless, servers, Ethernet SP routing, and high performance computing applications. 0N to 35N force range, and effective bulk conductivity of 40W/m∙K.
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A power delivery network of DCM DC-DC converters can be used independently or with downstream point-of-load ZVS buck and buck boost regulators to support efficient power delivery. These scalable, high efficiency DC-DC converters also provide superior power system performance and connectivity from a variety of unregulated power sources to the point of load.
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As your design requirements evolve, count on us for high-performance analog ICs that address a breadth of targeted functions in your consumer, communications, industrial, and medical applications. Our Essential Analog portfolio provides just the functions needed for your unique designs.
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Since 1977 Taimag designs and develops high-grade connector modules for industrial environments, complying with the extended temperature range. From Fast Ethernet to 10G – the current spectrum of industrial requirements is covered.
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Oxbotica has developed and deployed a deepfake technology that is capable of generating thousands of photo-realistic images in minutes; helping to expose its autonomous vehicles to the near infinite variations of the same situation - without real world testing of a location having ever taken place.
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BACnetInternational, KNX Association, OCF, Thread Group and the Zigbee Alliance have announced they are working together to better align commercial buildings with users' connectivity needs and to improve the integration of smart building products.
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With a 53% growth in the last three years, an active fundraising scene, and a 20% surge in-demand during lockdown - the UK fintech market has become the poster-boy for how an industry can be in a position to respond quickly to change and opportunity.
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