TI debuts new automotive chips at CES

Among them is the AWR2544 77GHz millimetre-wave radar sensor chip, a product for satellite radar architectures in the automotive industry. This chip is integral in augmenting sensor fusion and decision-making in Advanced Driver-Assistance Systems (ADAS).

Additionally, TI has introduced new software-programmable driver chips, including the DRV3946-Q1 integrated contactor driver and DRV3901-Q1 integrated squib driver, designed to support functional safety in battery management and powertrain systems. These products are being showcased at the 2024 Consumer Electronics Show (CES). More information on these products can be found at TI.com/AWR2544, TI.com/DRV3946-Q1, and TI.com/DRV3901-Q1.

Fern Yoon, Director of Automotive Systems at Texas Instruments, spoke about the impact of these innovations: “Semiconductor innovations like the ones we’re showcasing this year at CES are helping automotive systems continue to evolve and contribute to a safer driver experience. From more advanced driver assistance systems to smarter electric vehicle powertrain systems, TI is working alongside automakers to reimagine how reliable and intelligent technology can enable safer vehicles.”

TI's AWR2544 is the first single-chip radar sensor designed for satellite architectures, which use semi-processed data from radar sensors in a central processor for ADAS decision-making. This approach leverages 360-degree sensor coverage for enhanced vehicle safety. The AWR2544 is also the first sensor with launch-on-package (LOP) technology, allowing a 3D waveguide antenna to be mounted on the opposite side of the printed circuit board, reducing sensor size by up to 30% and extending sensor range beyond 200m.

To learn more about the benefits of the AWR2544 and satellite architectures, read the technical article, “Are you ready for the emerging automotive radar satellite architecture?” 

TI’s new DRV3946-Q1 and DRV3901-Q1 driver chips are integral for safer, more efficient control of high-voltage disconnect circuits in battery management systems (BMS) or other powertrain systems. These drivers are compliant with the International Organisation for Standardisation (ISO) 26262 functional safety standards and feature built-in diagnostics and protection.

At CES 2024, TI is also highlighting other automotive innovations, including system-level ADAS and BMS designs, as well as technologies across zone architectures, EV charging, and energy storage.

Henrik Mannesson, TI General Manager of Grid Infrastructure, will be a panellist in the CES 2024 discussion ‘Growth of the EV Marketplace: Innovations and Investments’ on January 11^th. He will discuss the role of semiconductor innovation in managing energy from EVs to the grid through bidirectional charging and vehicle-to-grid systems.

Attendees can visit TI at the Las Vegas Convention Centre North Hall, Meeting Room No. N116, from January 9-12^th. Additionally, preproduction quantities of the AWR2544, DRV3901-Q1, and DRV3946-Q1, along with evaluation modules, are available for purchase on TI.com, offering multiple payment and shipping options.