Qualcomm Dragonwing™ and Tria - accelerating new use cases through collaboration at embedded world 2025
Tria and Qualcomm discuss their collaboration for the launch of five new Tria modules based on Qualcomm Dragonwing and Snapdragon X Elite processors. Alex Wood, Global Marketing Director, Tria, and Douglas Benitez, Sr. Director, Business Development, Qualcomm Europe shed light on how they developed the product families prioritising power and efficiency, accelerating the embedded ecosystem.
The technologies offer powerful computing, power efficiency, making them ideal for the new generation of IoT devices. The enhanced AI performance opens new markets for AI deployment at the edge.
The Tria products demonstrated in the Qualcomm Technologies area of Tria’s stand at embedded world 2025 included:
- Tria IQ-9075 Vision AI-KIT powered by the Dragonwing IQ-9075 Processor
- Tria SMARC QCS6490 powered by the Dragonwing QCS6490 Processor
- Tria SMARC QCS5430 powered by the Dragonwing QCS5430 Processor
- Tria IQ-615 (OSM and SMARC) powered by the Dragonwing IQ-615 Processor
- Snapdragon X Elite (Com Express and Com HPC) powered by the Snapdragon X Elite Platform
One of several advantages of Tria’s new modules is that they are designed and manufactured in Germany.
Product Spotlight
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| Stock: | 50 |
| Cost: | $44.29 |
CAA572C0G3A663J640LJ
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| Stock: | 1037 |
| Cost: | $9.16 |
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| Stock: | 7095 |
| Cost: | $0.76 |
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