Leading edge semiconductor research on 200/300mm wafers

9th November 2023

Fraunhofer

Paige West

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The Fraunhofer Institute for Photonic Microsystems IPMS, situated in Silicon Saxony, provides both large-scale chip manufacturers and smaller entities access to cutting-edge photonic microsystems technology.

Utilising 200 and 300mm silicon wafers, the institute extends a comprehensive range of services, from expert consultancy and developmental processes to pilot-scale production. Emphasising sustainability in Information and Communication Technology (ICT), IPMS integrates Green ICT principles into its offerings.

The institute's prowess in MEMS technologies spans the complete spectrum of value, from singular processes to complete technological solutions, and even includes cleanroom equipment support. Notably, IPMS facilitates pilot production and assists in technology transfer, covering Technology Readiness Levels (TRLs) three to eight. This approach benefits startups, SMEs, and firms lacking their own fabrication facilities, enabling them to access high technology at reduced investment costs. For example, IPMS develops capacitive ultrasonic sensors, providing a platform for swift, customer-specific modifications.

Moreover, IPMS's Centre for Nanoelectronic Technologies (CNT) focuses on applied research for 300mm wafers, serving chip producers, suppliers, and R&D collaborators. Services encompass technology development in areas like atomic layer deposition and chemical-mechanical polishing, among others. The CNT also prioritises R&D in front-end areas, including non-volatile memories and advanced packaging. In partnership with Applied Materials, a metrology and process analysis centre has been established, integrating top-tier eBeam metrology equipment to assure microchip quality.

In the arena of Green ICT, IPMS is actively engaged in reducing resource consumption through innovative approaches in both production and design. Collaborating with the Research Fab Microelectronics Germany (FMD), the institute contributes to the development of energy-efficient sensor edge cloud systems and resource-optimized electronics production. This encompasses the refinement of material use, alternative material sourcing in wet processes, and lithography, as well as improving energy efficiency and reducing emissions.