MacDermid Alpha to showcase latest circuit board assembly innovations

MacDermid Alpha’s latest low temperature innovation, ALPHA OM-565 HRL3 solder paste, will be a highlight at all three SMTA Expos. The paste is designed to minimize warpage induced defects and enhance product reliability compared to existing low temperature solutions. At the SMTA Chihuahua Expo, Francisco Gallegos, Customer Technical Support Engineer – Mexico, will present a paper on this topic with  ‘Low Temperature Soldering: Traditional Sn-Bi alloys and Latest Developments in High Reliability Alloys for SMT and PTH Applications’.

Additionally, MacDermid Alpha will promote the ALPHA HiTech range of adhesives, underfills, edgebonds and encapsulants. These epoxy-based materials provide reinforcement and protection for soldered assembled components, enhancing reliability. Sustainability initiatives will also be a key focus, with emphasis on MacDermid Alpha’s Reclaim and Recycling Services. Offering safe and efficient recycling services, this service helps companies meet their environmental and legislative requirements, and at the same time, maximize the value of their waste streams.

2022 is an important milestone for MacDermid Alpha with the business celebrating 250 years of combined innovation. The MacDermid brand is celebrating 100 years of supplying specialty chemical solutions for the most complex printed circuit board and IC substrate designs. The Alpha brand is celebrating 150 years of providing high performance component attachment materials for the electronics assembly industry.

For more information on the SMTA Expos please visit: Events - SMTA

To learn more about MacDermid Alpha’s circuit board assembly solutions please visit: macdermidalpha.com