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COMs just got even cooler
congatec premiered its heat pipe cooling solution for extreme environmental conditions at embedded world 2025. The cooling solution uses acetone as a working fluid in the heat pipes instead of water. This prevents the thermal transfer medium from freezing at extreme sub-zero temperatures and prevents damage to the cooling solution, the module, and the entire system design. It is also insensitive to mechanical stresses such as shock and vibration....
YINCAE: UF 158UL redefines underfill for large chips
YINCAE has unveiled its latest innovation in underfill materials with the introduction of UF 158UL. This advanced underfill solution is engineered to address the increasing challenges associated with large format chips, offering superior performance in flowability, rapid curing, and long-term reliability. As semiconductor technology continues to evolve, the need for highly efficient and dependable underfill materials becomes more critical, partic...
Magnachip introduces 25 Gen6 SJ MOSFETS for AI, industrial, and smart appliances
Magnachip has announced a significant expansion of its product lineup with the launch of 25 new 6th-generation (Gen6) SJ MOSFETs (super junction metal-oxide-semiconductor field-effect transistors).
TI introduces the world’s smallest MCU
Texas Instruments (TI) has introduced the world’s smallest MCU, expanding its comprehensive Arm Cortex-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimise board space in applications such as medical wearables and personal electronics, without compromising performance.
Parasoft supports MISRA C:2025 for safety-critical software
Parasoft is accelerating the release of its C/C++test 2025.1 solution, following the just- published MISRA C:2025 coding standard. Building upon decades of MISRA compliance, Parasoft continues to fortify the development of safety-focused and security-critical software as an active member of the MISRA C and MISRA C++ working groups.
ITTIA boosts embedded data management with ITTIA DB lite
ITTIA announces the immediate availability of ITTIA DB Lite, a new member of the ITTIA DB product family, for Cortex-M microcontrollers and electronic control units.
ST brings quantum resistance to embedded systems
STMicroelectronics has introduced hardware cryptographic accelerators and associated software libraries for general-purpose and secure microcontrollers, ready for future generations of embedded systems to resist quantum attacks.
ADI expands CodeFusion Studio for development and security
Analog Devices has unveiled an expanded version of its developer-centric offerings with new solutions to drive more efficiency and security for developers and provide increased customer value.
Synaptics launches triple combo SoC family
Synaptics has extended its award-winning Veros triple combo connectivity portfolio with the SYN461x family of ultra-low-power (ULP) Wi-Fi 2.4/5/6 GHz, Bluetooth 6.0 and Bluetooth Low Energy (BLE), and IEEE 802.15.4 (Zigbee/Thread) systems on chip (SoCs).
Synopsys introduces Virtualizer Native Execution on Arm hardware
Synopsys has announced the availability of Synopsys Virtualizer Native Execution on Arm-based hardware, transforming software development for Edge devices by substantially1 accelerating virtual prototype execution and deployment. This innovation delivers new, advanced capabilities that improve the productivity of engineering teams building software-defined products in the automotive, high-performance computing (HPC), and Internet of Thi...