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DigiKey, a pioneering global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, announces it has added ISO 27001 certification to its robust data security programme.

Global industrial sensor expert SICK has unveiled the latest in its extensive product range with the IMG inductive sensor, designed specifically to provide stable detection in harsh environments.

Allegro MicroSystems, a global pioneer in power and sensing solutions for motion control and energy-efficient systems, announces the launch of the third product in its High Voltage Power-Thru portfolio.

Hewlett Packard Enterprise (HPE) and NVIDIA have announced NVIDIA AI Computing by HPE, a portfolio of co-developed AI solutions and joint go-to-market integrations that enable enterprises to accelerate adoption of generative AI.

Q-Tech, a global supplier of space-qualified crystal oscillators and high-performance frequency control systems, announces its expanded offering of high-stability microprocessor compensated (MCXO) and oven-controlled (OCXO) crystal oscillators.

NVIDIA researchers are at the forefront of the rapidly advancing field of visual generative AI, developing new techniques to create and interpret images, videos, and 3D environments.

Maastricht Aachen Airport (MST) is to host the first publicly accessible electric powered flights between the Netherlands, Belgium, and Germany having successfully facilitated a joint venture initiative.

DSEI has rebranded to reflect its commitment to innovation, integration, and excellence within the global defence industry.

At this week’s IEEE RFIC Symposium, imec, a global pioneering research and innovation hub in nanoelectronics and digital technologies, presents a state-of-the-art CMOS-based beamforming transmitter for D-band wireless applications.

Lynred, a global provider of high-quality infrared sensors for the aerospace, defence, and commercial markets, announces it will showcase Seegnus, its first very compact high-resolution (1280 x 1024 SXGA format), small pixel pitch (7.5µm) midwave (MWIR) ‘HOT’ (high operating temperature) infrared sensor, at Eurosatory, Paris, 17–21 June 2024, at booth #5A-C155.