Filtronic adds new capabilities with plastic encapsulation equipment

Filtronic is one of just a handful of companies in the Europe that has the technology and knowledge to offer this service.

Filtronic has been in radio frequency, microwave and mmWave technology for >45 years, and the new plastic encapsulation investment is a testament to the company’s commitment to continuous improvement, quality, and innovation.

“Traditionally, plastic encapsulation of high reliability semiconductors has only been accessible to companies and sectors that operate with extremely high volumes, because of the costs of the tooling for just one product line,” explained Jerry Sanham, Director of Business Development at Filtronic. “However, because of Filtronic’s unique approach, we can now provide a flexible and economically viable service to companies running product lines for anywhere between a few thousand and a few hundred thousand parts.”

The new plastic encapsulation service is a further addition to Filtronic’s expanding UK manufacturing capability and demonstrates its commitment to providing the aerospace and defence market with the technology required for next generation platforms. With this new assembly capability, Filtronic is ensuring that it can provide smaller package solutions with lower weight and reduce costs for customers wishing to avoid long supply chains and offshore manufacturing.

Filtronic’s new equipment has been partly funded by a grant from the County Durham Growth Fund.