Vi TECHNOLOGY demos inspection systems at SMTAI 2014

Enabling customers to see and measure the print process like never before, the Pi has been claimed to be the first SPI to use angle cameras to measure the solder paste deposit. 360° Moiré technology taking about 352 images per field of view in combination with a powerful computing system (Vi claim it to be 100 times more computing power than conventional solutions), the SPI system provides an ultra large image in 3D true colour. Offering large PCB capabilities (up to 533x600mm) within a very small envelope (only 800mms wide), the Pi responds to the increasing constraints on floor space in modern SMD lines.

Combining state-of-the-art 2D inspection with a 3D option, the 5K 3D Selective (AOI) checks coplanarity issues on BGAs, QFNs, QFPs, connectors or larger components. 2D inspection is suitable for 95% of component inspection, so the 3D should only be applied when needed. The 5K 3D Selective system is upgradable on most of the latest AOI systems.

Multi-process review software, Sigma Review enables users to access information from the post-print inspection or post placement inspection at post-reflow inspection. This provides valuable information about the process as the user can check if the defect caught post-reflow is caused by the print process or not (all pictures and data are stored even for good print processes). This enables users to, if needed, adjust the print process inspection (tolerances) in order to catch defects at that stage.