TRI to exhibit at NEPCON China 2023

TRI will showcase the high-speed multi-angle 3D AOI, TR7500QE Plus, equipped with four side cameras and 1 top high-resolution camera. Also exhibiting will be the 3D AOI TR7700Q SII with an industry-leading speed of up to 57 cm2/sec. TRI will also showcase the 3D SPI TR7007Q Plus, equipped with an improved motion controller and enhanced 2D lighting for sharper inspection images. TRI's lineup includes the high-end 3D AXI TR7600F3D SII and the Multi-core ICT TR5001Q SII LED INLINE.

TRI's High Accuracy and High-Resolution Optical Inspection Solutions are also designed to inspect Die/Wire bonding, underfill, bumps, and more. Visit our booth to discuss TRI's Semiconductor and Advanced Packaging Industry applications.

Also presenting at NEPCON China will be TRI's AI-powered Repair Station, the AI Station, which optimises the inspection, increases efficiency, and lowers the operational cost for the experienced workforce, all this by using existing AI Models.

TRI's systems are designed to interoperate with other manufacturing equipment to minimise downtime, optimise production quality, and reduce operator workload. TRI is actively participating in the development and adaptation of the emerging and pioneers Industry 4.0 and M2M Communication Standards. TRI solutions comply with Industry 4.0 standards like the IPC-Hermes-9852 and the Connected Factory Exchange (IPC-CFX).