TRI to display new wafer inspection and metrology solution

Joining TRI at booth #N0990 will be OmniMeasure, TRI's SEMI inspection partner.

Attendees visiting TRI's booth will have the opportunity to explore AI-powered Automated Optical Inspection (AOI) solutions tailored for the Semiconductor and Advanced Packaging Industry. TRI offers comprehensive SEMI Inspection solutions for Advanced Wafer Level Packaging (WLP), Panel Level Packaging (PLP), and SEMI Back-End Package processes.

One of the highlights of TRI’s exhibition will be the new Wafer Inspection Platform, TR7950Q SII. This platform features a 25MP camera with 2.5μm resolution and a 12MP camera with a 0.55μm microlens, enabling high-resolution 2D/3D Defect-Free (DFF) inspection with AI-powered algorithms. The TR7950Q SII is designed for detailed Wafer Macroscopic 3D Inspection and precise micro measurement metrology. It can efficiently inspect Advanced WLP, Wafer Frames, Patterned Wafers, Wafer Bumping, Wafer Level Chip Scale Packages (WLCSP), and through-silicon vias (TSV). Thanks to the TSV module from OmniMeasure, the TR7950Q SII can perform ultra-high-speed TSV inspections, including measuring TSV depth, trench depth, and film thickness of oxide, nitride, PR, and PI.

In addition to the TR7950Q SII, TRI will showcase its latest back-end inspection solutions, the TR7007Q SII-S and TR7700Q SII-S. The TR7007Q SII-S is adept at inspecting Mini-LEDs, C4 bumps (~100μm diameter), and 008004 paste applications. The AI-powered 3D SEMI AOI, TR7700Q SII-S, can handle inspections of die, wire diameters up to 15μm (0.6 mil), System-in-Package (SiP), underfill, bumps, and more. The exhibit will also feature an X-ray Inspection Demo Station, demonstrating TRI's SEMI AXI solutions for inspecting C4 bumps and copper pillars.

OmniMeasure will present its TGV (Through Glass Via) 3D Viewer, a metrology tool that uses non-contact tomography to provide clear cross-sectional views of glass vias. The TGV viewer also measures side wall angles without the need for Scanning Electron Microscopy (SEM).

Join TRI at Booth No. N0990 at SEMICON Taiwan 2024 to discover TRI's latest SEMI applications and cutting-edge inspection innovations for the Semiconductor and Advanced Packaging Industry.