TI to showcase sustainability and intelligence at electronica 2024

TI's exhibit in hall C4, booth 159 will showcase the latest advancements in application areas such as robotics, industrial communications, artificial intelligence, energy infrastructure and software-defined vehicles.

TI will showcase how its innovative semiconductors, intuitive software and design expertise can help developers meet the growing demands for smarter, data-driven decision-making.

Enhancing efficiency on the factory floor

Advanced factory automation with TI industrial communications solutions: TI will highlight their certified, production-ready hardware and software for industrial communications using PROFINET, EtherCAT and EtherNet/IP software stacks. See how the technology enables seamless connectivity and real-time deterministic motor control with a single chip and licensed software for multi-protocol industrial Ethernet and Time Sensitive Networking (TSN) over single-pair Ethernet.

Pick-and-place robot using vision processors and AI pose estimation: This robotic pick-and-place demonstration is enabled by the phyCORE-AM68A system-on-module and utilises the AM68A Arm®-based processor which features a deep learning accelerator with an edge AI-based human pose estimation model. Visual data is pipelined through the AM68A SoC acceleration units to analyse the key points of the human pose to annotate and control the position of the robotic arm.

Bringing intelligence to industrial and automotive systems

Solar arc fault detection with edge-AI MCUs: TI will showcase MCUs with edge AI capabilities for arc fault detection in solar energy systems. A dedicated hardware accelerator offloads the execution of the neural-network model from the main CPU, allowing enough computational and processing bandwidth to be reserved for high-accuracy, low-latency arc fault detection.

Software-defined vehicles central gateway: TI will demonstrate how its processor technology enables software-defined vehicles in next-generation zone-based architectures. Using eSync technology implemented by Excelfore, a central gateway, based on the DRA821-Q1 automotive processor, will manage over-the-air updates between the cloud and the advanced driver assistance systems’ (ADAS) electronic control units using vision processors. 

Advancing energy for a sustainable future

10kW GaN-based solar inverter: TI will showcase its single-phase string inverter with 2 MPPT inputs, non-isolated DC/DC battery energy storage and a configurable DC/AC converter, achieving high power density and 98% efficiency with TI GaN technology.

Speakers at electronica:

• Tuesday, November 12 – Embedded AI: Bridging the gap from high-level neural network design to low-level embedded execution: Arthur Redfern will participate in Embedded Computing Design’s IIoT Forum and discuss design challenges and solutions to mapping high-level neural networks to low-level embedded hardware.
• Tuesday, November 12 – Reinventing real-time control with advanced CPU architecture: Chen Yu Chang will present an overview of the CPU architecture, examine its benefits in performance with industry benchmarks, and showcase the enhanced safety and security functionality of the CPU architecture.
• Friday, November 15 – Network redundancy for smart grid performance measurements: Daolin Qiu and Pekka Varis will present measurements of CPU load, bridge delay and other key performance metrics of offloaded High-Availability Seamless Redundancy (HSR) on embedded processors. They will discuss how offloaded HSR forwarding with cut-through switching can enable meeting deterministic end-to-end latency in a larger network.

Visit TI at booth 159

A full demo list with descriptions is available upon request.

Interviews with TI experts are available upon request. Topic areas include:

• Factory automation (robotics, industrial communications, software)
• Edge AI and intelligent systems
• Energy infrastructure and sustainability
• Software-defined vehicles and autonomous driving
• Wireless connectivity
• Manufacturing and product distribution - more details on embargoed news to come
• Product news announcement - more details on embargoed news to come