Symposium targets the advanced packaging industry

The symposium, which will take place on 28th August 2014, in Wuxi, China, will be presented in three sessions: interposer & 3D integration technologies, sensors & MEMS packages and manufacturing challenges. This will offer packaging organisations from China and around the world the opportunity to debate current and future trends of packaging, as well as manufacturability and collaboration activities across the industry. At the end of the symposium there will be a panel discussion, moderated by Rozalia Beica (Yole), which will be dedicated to advancements in packaging technologies. 

“In the past couple of years, we have seen a high interest in embedded technologies, either as a fan-out wafer level packaging or embedded dies and systems in laminate substrates. During the symposium, we’ll look at the various embedding technologies and activities happening in the industry, the industry players currently active as well as the infrastructure required for further high-volume manufacturing adoption”, says Jérôme Azemar, Technology & Market Analyst, Advanced Packaging.

“Since product announcements using 3D IC technology have finally been made for high-end applications, and engineering samples have already started to be shipped, there is no doubt anymore that 3DIC will be adopted for this segment.The question remaining is when will the consumer market, where the cost is so critical, will follow TSV adoption?...” says Rozalia Beica, CTO, Yole.