StratEdge’s RF and high-power solutions at iMAPS HiTEC and CMSE

StratEdge's moulded ceramic packages offer robust reliability, designed to handle high-frequency chips up to 18GHz, with over 200 standard outlines available, providing a vast array of packaging options. Many open-tooled designs are available with 50 ohm impedance high-frequency transitions, which provide convenience and ease for packaging high-performance semiconductors.

StratEdge’s packages are built for maximum reliability in power and RF applications under extreme conditions. Its moulded ceramic packaging solutions offer robust thermal dissipation and high-frequency performance. According to Casey Krawiec, VP of Global Sales at StratEdge, “Our moulded ceramic packages are extremely popular where devices encounter harsh environments. Testing has shown they can withstand extended exposures at over 500°C, which is why they’re selected for automotive, down-hole, jet engine, and other high-temperature applications, as well as traditional uses in space and defence.”