StenTech at SMTA Chihuahua 2023

The company will exhibit its highly acclaimed Advanced Nano Coating and showcase its complete product line of various stencils and tooling.

As electronic packaging continues to push the boundaries of miniaturisation, the challenge of achieving precise solder paste deposition and meeting evolving IPC requirements remains ever-present. StenTech's award-winning Advanced Nano Coating provides a groundbreaking solution to this challenge. This highly unique 1-3 um hardened nano-coating, applied to the bottom side and inside the apertures of the stencil, offers exceptional anti-adhesion properties, effectively repelling solder flux and ensuring increased transfer of paste.

With StenTech's Advanced Nano Coating, transfer efficiency can be boosted by up to 25%, resulting in a significant reduction of bridging and paste-related defects. The "non-stick" characteristics of the coating also lead to reduced underside cleaning, contributing to improved yields and reduced expenses on rework and touch-up. Additionally, stencils coated with Advanced Nano are ready for use in just 30 minutes after coating, enhancing production efficiency and minimising downtime.

StenTech's legacy of pioneering stencil technology, including the introduction of Fiber Diode lasers into North America, has firmly established the company as an industry leader. With a team of over 30 experienced CAD designers, StenTech provides unparalleled support in stencil modifications, material recommendations, and thickness specifications, ensuring optimised stencil solutions for every application.

At the SMTA Chihuahua expo, visitors to the StenTech booth will have the opportunity to explore the full range of stencil technology offerings, custom-tailored to meet specific manufacturing needs in the SMT industry. The company's dedication to innovation and customer satisfaction makes StenTech a trusted partner for companies seeking cutting-edge solutions to their electronic packaging challenges.