SPI & AOI systems to be exhibited at NEPCON Japan

8th January 2015

Barney Scott

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CyberOptics has announced that it will exhibit its latest lineup of SPI and AOI systems at its representative TOYO Corporation’s booth E6-002 at NEPCON Japan, scheduled to take place 14^th to 16^th January, 2015 at the Tokyo Big Sight.

The SE600 3D SPI system delivers ‘true’ volume measurement and usability. Designed with a dual illumination sensor, it offers repeatability and reproducibility, even on the smallest paste deposits. The SPIv5 series software offers touch screen capability and intuitive UI for easy, flawless inspection.

The QX150i AOI system offers high value, flexible inspection for all applications and is suited for pre-reflow and selective solder inspection. With sensor resolution of 12µm and enhanced illumination, QX150i offers crisp images for accurate inspection with lowest false call rates. Also, the system is designed to provide easy wedge-in replacement of existing conveyors.

The QX100 combines the performance of an in-line inspection system with the flexibility of a tabletop system. The system features CyberOptics’ unique image acquisition technology, the Strobed Inspection Module (SIM), and is capable of inspecting component sizes down to 01005.

All CyberOptics’ AOI systems are powered by AI² (Autonomous Image Interpretation), giving you the power to inspect ‘anything’ without having to anticipate defects or predefine variance. AI² offers precise discrimination even with excessive variance and delivers accurate results with just one example. All this means lowest false calls, zero escapes and minimal tuning.