Solvay to showcase materials portfolio at Semicon Taiwan 2022

From September 14th to 16th at Booth N0584, the company will highlight its offering of specialty polymers and chemicals covering all stages of front-end-of-line (FEOL) and back-end-of-line (BEOL) semiconductor manufacturing, testing and assembly.

From high-performance polymers to slurry abrasives, gases, and wet chemicals, the company’s material solutions are engineered to meet the unique and complex needs of manufacturers in this dynamic market and push the limits of chip performance with outstanding purity, long-lasting chemical stability and optimised resistance to high temperatures and plasma.

A wide range of structural and internal parts moulded in KetaSpire PEEK, Torlon PAI, Halar ECTFE, Hyflon PFA and MFA, Solef PVDF and Algoflon PTFE demonstrate the perfect fit of Solvay’s specialty polymers in FEOL processes such as dry and wet etching, cleaning, chemical vapor deposition (CVD), chemical mechanical planarisation (CMP) and lithography. Furthermore, Tecnoflon FFKM is used for O-rings and seals, Fluorolink for CMP pads, Fomblin PFPE serves as a lubricant in vacuum pumps, and Galden PFPE ensures proper heat transfer in chillers.

Many of these materials also extend into wafer handling, duct coating, filters, piping, and tubing as well as BEOL processes from wafer level packaging (WLP) to probing and testing. The portfolio is complemented by dedicated specialty chemicals such as Sifren C4F6 cleaning gas for etching, Interox H2O2 hydrogen peroxide for optimised wet etching and Cypure PH3 cylindered phosphine dopant gas. In addition, Solvay has confirmed its active commitment to the semiconductors industry with a new joint venture – Shinsol Advanced Chemicals – for the development, production, and marketing of electronic-grade hydrogen peroxide, located close to the Southern Taiwan Science Park near Tainan and scheduled to begin operations in 2023.