Solderstar to spotlight the reflow shuttle with O2 at IPC Apex

From the 9-11^th April, at Booth 2538 in Anaheim, California, Solderstar will present the newly launched Reflow Shuttle with O2 measurement module. This innovation is set to transform soldering process optimisation, providing manufacturers with precision and control.

The Reflow Shuttle O2 is the first instrument to incorporate real-time oxygen (O2) measurement in parts per million (ppm), vibration monitoring in three axes, vacuum readings, temperature profiles, and conveyor speed into a single unit. This amalgamation of crucial metrics enables manufacturers to make well-informed decisions and precisely optimise their reflow soldering operations.

"Precision and control are vital in reflow soldering," stated Mark Stansfield, CEO of Solderstar. "The Reflow Shuttle with O2 measurement module offers detailed insights into essential parameters, providing manufacturers with the necessary tools for effective decision-making and process enhancement.

“By merging measurement systems into a single, durable platform, we are equipping manufacturers with the data to improve quality and efficiency in their soldering tasks with just one pass through the machine. We are excited to showcase this innovative solution at IPC Apex Expo and demonstrate how it can improve attendees' manufacturing processes."

Maintaining precise control over O2 levels is critical in electronics manufacturing, as it greatly influences the quality of solder joints. The Reflow Shuttle O2 facilitates meticulous monitoring of oxygen levels across each zone, enabling manufacturers to assess nitrogen usage accurately and swiftly identify any process discrepancies.

The Reflow Shuttle O2, designed for effortless integration with existing reflow ovens, reduces downtime during verification steps and features an intuitive interface that eases data collection for operators, allowing for quick adjustments when anomalies are detected. Its adaptable design, equipped with a custom battery pack and Smartlink connector, ensures uninterrupted verification across multiple production lines. Crucially, the module offers zone-by-zone oxygen level analysis during the reflow process, providing manufacturers with detailed insights to precisely monitor oxygen levels and identify nitrogen leaks, thus optimising nitrogen use and maintaining process integrity.

Alongside the Reflow Shuttle with O2 measurement module, Solderstar will also display its zero set-up SLX thermal profiler at the booth. The SLX thermal profiler, known for its accuracy and compact size, captures and analyses temperature profiles in different soldering processes.

The SLX is celebrated for its extensive data capture functionality, which further improves process oversight and product quality. It automatically recognises connected test adapters and seamlessly auto-configures settings, removing the need for manual adjustments and saving significant time.

Visitors are encouraged to stop by Booth 2538 at IPC Apex Expo 2024 in Anaheim, California, to witness the Reflow Shuttle O2 measurement module firsthand and discover Solderstar’s array of advanced profiling tools for reflow, wave, vapor, and selective soldering processes, including the innovative, zero set-up SLX.