Solderstar to showcase at EPP InnovationsFORUM 2024

The Reflow Shuttle O2 represents a significant step forward by incorporating real-time oxygen level monitoring in parts per million (ppm) with other essential process parameters such as vibration, vacuum, temperature profiles, and conveyor speed into a singular, comprehensive platform. This innovative blend affords manufacturers an unprecedented level of insight and control over their soldering processes.

Chris Williams, Head of European Sales at Solderstar, commented: "April is an exciting time for us as we participate in two significant events - IPC APEX Expo in the U.S. and the EPP InnovationsFORUM in Europe. We're delighted to demonstrate our innovative thermal profiling systems, including the Reflow Shuttle O2, at both venues.

"The Reflow Shuttle O2 meets a vital need in advanced manufacturing by offering precise, real-time monitoring and control of oxygen levels throughout the reflow process. Its zone isolation technology identifies changes in oxygen levels, enabling users to fine-tune nitrogen usage, swiftly pinpoint leaks throughout the oven, and maintain high-quality solder joint integrity consistently. This precision is crucial for high-precision applications, allowing for the identification of problem areas within the oven and the quantification of nitrogen usage, thereby enabling data-driven process improvements."

In addition to its oxygen monitoring capabilities, the Reflow Shuttle O2 is equipped with advanced measurement modules. Its vibration sensing across three axes sets acceptable operational parameters, while dedicated vacuum sensors confirm pressure levels down to 10mbar, assessing key metrics like hold times to prevent component shifts.

High-accuracy sensors closely monitor the performance of both top and bottom heaters, offering valuable insights into heat uniformity. Located at the front of the Shuttle, temperature sensors, calibrated for precision, provide essential data on the evenness of heating throughout the entire heated zone.

Solderstar's latest profiler simplifies the verification process by integrating various measurement tools into a single, durable shuttle, designed for easy integration into any reflow oven. The user-friendly interface facilitates data collection and allows for real-time adjustments to be made based on process variations identified.

The EPP InnovationsFORUM 2024 offers an ideal opportunity to highlight the benefits of the Reflow Shuttle O2 to Europe's electronics manufacturers. Solderstar's team of specialists will be available to offer in-depth insights, conduct live demonstrations, and address any technical questions.