Solder paste evaluation process presented at IPC APEX
A new process for evaluating solder pastes will be demonstrated by FCT Assembly in Booth #713 at IPC APEX, 24th to 26th February in California. Tony Lentz, Field Application Engineer, will present the paper written on the new evaluation process. 'Dispelling the Black Magic of Solder Paste' will be held during the Fluxes Technical Conference Session on 24th February from 1.30 to 3pm.
Lentz will present a process for evaluating solder pastes using a variety of methods which are quick to run and challenging, revealing the strengths and weaknesses of solder pastes. Methods detailed in this paper include: print volume, stencil life, response to pause, open time, tack force over time, wetting, solder balling, graping, voiding, accelerated ageing and others. Hard data is gathered and used in the evaluation process.
Lentz will also present a set of methods that do not require expensive equipment or materials, but still generate useful data. The goal is to help the electronics assembler choose the best solder paste for their process.
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