SEMI and SMT inspection solutions at NEPCON Japan 2025
Test Research, Inc. (TRI) will join NEPCON Japan 2025, held at Tokyo Big Sight from January 22-24, 2025.
Visit booth #E15-40 to experience the latest test and inspection innovations for the SMT and Advanced Packaging/Semiconductor Manufacturing industry.
TRI will showcase the latest back-end inspection solutions, TR7007Q SII-S and TR7700Q SII-S. The TR7007Q SII-S can inspect Mini-LED, C4 bumps (~100 μm Ø), and 008004 paste inspection applications. The AI-powered 3D SEMI AOI, TR7700Q SII-S, can inspect die, wire diameters of up to 15 μm (0.6 mil), SiP, underfill, bumps, and more.
Also presenting at NEPCON Japan will be the High-Speed Multi-Camera 3D AOI, TR7500QE Plus, the High-Speed 3D CT AXI TR7600 SIII for multiple industry applications and the modular board tester, TR5001E SII.
Featured products
MAX17793
Analog Devices Inc.
3V to 80V, 3A, High-Efficiency, Synchronous Step-Down DC-DC Converter
| SKU: | MAX17793 |
|---|---|
| Stock: | 9316 |
| Cost: | $3.64 |
MAX22516
Analog Devices Inc.
IO-Link Data Link Controller with Transceiver and Integrated DC-DC
| SKU: | MAX22516 |
|---|---|
| Stock: | 8000 |
| Cost: | $5.42 |
