SECO will showcase products built on Intel processors

SECO’s lineup will highlight advancements in performance, scalability, and efficiency, featuring products tailored for applications across industrial, medical, and AI-driven industries.

The Intel Processor N-series, built on the code-named Twin Lake architecture, is tailored for applications that require dependable performance and low energy consumption featuring a thermal design power (TDP) ranging from 6W to 15W and configurations with up to 8 efficiency cores.

With the new SOM-SMARC-TWL, SECO leverages the Smart Mobility Architecture (SMARC) form factor, known for its compact size and high versatility. It provides connectivity options such as 2x NBase-T (2.5GbE supported), 2x USB 3.2 Gen 2, 6x USB 2.0, and 4x PCI-e Gen 3 lanes with optional SERDES. The memory configuration includes quad channel soldered LPDDR5 with in-band error correcting code (IBECC) capability.

Similarly, the new SOM-COMe-CT6-TWL utilises the versatile COM Express Type 6 Compact form factor and features more connectivity options. Both solutions can operate at industrial temperatures ranging from -40°C to +85°C.  

The Intel Core Ultra Processors (Series 2), built on the code-named Arrow Lake architecture, introduce a multi-chip module (MCM) design that improves scalability and efficiency. These processors combine Lion Cove performance (“P”) cores and Skymont efficiency (“E”) cores to optimise computing tasks, while support for DDR5 memory and PCIe 5.0 ensures fast data transfer rates and high memory bandwidth. Integrated Thunderbolt 4 and USB 4 provide seamless connectivity, while advanced AI acceleration enabled by a built-in neural processing unit (NPU) reaches 13 trillion operations per second (TOPS).

The new SOM-COMe-BT6-ARL, leveraging the COM Express form factor, offers robust connectivity options including 1x NBase-T 2.5 GbE, 4x USB 10 Gbps, 8x Hi-Speed USB, and up to 20x PCI-e Gen4 lanes. Its memory configuration features two SO-DIMM slots supporting up to 64 GB of DDR5-5600 IBECC memory each, with a total capacity of up to 128 GB, making it a good choice for high-performance Edge computing.

On the other hand, the SOM-COM-HPC-A-ARL takes advantage of the advanced COM-HPC (high performance computing) form factor, designed for the most cutting-edge of applications. It supports state-of-the-art interfaces such as PCIe Gen 4/5 and USB 4, and offers connectivity options including 2x 2.5GbE, 4x USB 4.0 / USB 3.2, 4x USB 2.0, PCIe Gen 3 8x1, and PCIe Gen4 1x8 or 2x4. An optional on-board Wi-Fi 6E + BT 5.3 radio is also available. The memory setup includes two SO-DIMM slots supporting DDR5 memory.

Deploying Edge devices effectively requires seamless integration across hardware, drivers, operating system, and applications—all while addressing cybersecurity, AI capabilities, and real-time performance requirements. SECO's Clea software suite provides this integration across the entire Intel-based product lineup and more. 

Operating at the Edge, Clea OS delivers a complete Linux board support package built on the Yocto project. It provides an integrated DevOps infrastructure with CI/CD pipelines for automated testing, along with device drivers, IoT data orchestration, device management functionalities, and security functions. This comprehensive stack enables developers to focus on application logic rather than infrastructure. 

For Cloud functionality, Clea provides a matching platform for data orchestration and device management, providing features such as over-the-air (OTA) fleet software/configuration updates, geolocation and more, along with a user portal for direct management of networks. 

The platform has already proved successful in sophisticated deployments, with use cases from predictive maintenance in manufacturing to emergency response systems in smart cities, to generally providing services based on IoT data consumption on top of the physical product offering. By abstracting away hardware complexity while handling real-time analytics, Clea enables developers to fully leverage advanced processors including those based on the Twin Lake and Arrow Lake architectures.

Visitors to the SECO booth at embedded world will be able to discover a live demo of SECO products featuring Intel solutions, showcasing its SOM-COMe-BT6-MTL, a COM Express module powered by the latest Intel Core Ultra processors with NPU, delivering up to 34 TOPS of AI performance. Through an intuitive GUI, the demo features a multi-modal large language model (LLM), enabling users to generate AI-driven images from basic text inputs using OpenVINO libraries.

At Intel’s booth, SECO will showcase the Clea AI EV Charging Station, a solution for managing EV charging fleets, transforming data into actionable insights. It enables predictive maintenance, remote fault correction, smart digital signage, license plate recognition, revenue optimisation, and fleet management. Edge-collected data is processed with Clea and sent to the Cloud for remote monitoring. The system includes a touch screen display, contactless payment terminal, and AI-powered digital signage for personalised advertising.