Scanning electron microscope features in Grenoble

The annual EMLC conference brings together scientists, researchers, engineers, and technologists from research institutes and companies from around the world to present innovations at the forefront of mask lithography and mask technology.

Also highlighted at the booth will be Advantest’s F7000 EB (electron beam) lithography system, which delivers high throughput and highly-accurate and smooth nano-patterns on wafers and masks from 1X-nm resolution.

Its direct-write technology makes it well suited as a design tool for research and development as well as a solution for LSI production lines, where small-lot-multiple-type devices are produced. Using character projection technology, the system offers high throughput for both prototyping and production.

Advantest’s portfolio of nanotechnology solutions also includes several other products. Among them are the E3310 and E3640 Mask MVM-SEM systems which enable real-time, 3D measuring and imaging of wafers and masks.

For tri-gate processes, the E3310 Wafer MVM-SEM offers high efficiency for volume production. The E3640 Mask MVM-SEM system delivers the industry’s best pattern-measurement capability and high throughput for applications including standard photomasks, EUV photomasks and NIL templates.

While the E5610 Mask DR-SEM is designed for reviewing and classifying ultra-small defects in next-generation photomasks and blanks.

The system offers highly stable, fully automatic image capturing with the long-term operational stability and reliability essential for manufacturing analyses of critical masks.