Saki Demonstrates XL 3D AOI System

22nd September 2016

Enaie Azambuja

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Saki will demonstrate its BF-3Di-Z1 3D AOI system for extra-large (686x870mm) PCBs and easy-to-program real-time software in booth 726 at SMTA International, being held at the Donald Stephens Convention Center, Rosemont, IL. Saki's 3D AOI systems measure heights from 0-20mm with 1µm resolution, measure the surface of surface mount devices and through-hole packages from all four directions without a dead angle or shadowing, and achieve full automation with very low false calls and zero escapes.

Saki's BF-3Di Series inspects the entire PCB and provides seamless merging of the acquired images into a single image, even for multiple fields of view of very large components. It inspects QFNs, J-leads, and connectors, and enables the detection of the most difficult defects, such as lifted leads, tombstones, reverses, and height variations, without a reduction in speed.

Saki's Auto Programming Software significantly reduces library creation time. Optimal inspection libraries are automatically assigned and created by utilising Gerber and CAD data. Pad shape information is used to provide automatic inspection based on IPC standards.

Reliable threshold settings are determined from statistical information and model images are provided in the offline debug feature, which is installed on every machine. The board is not needed for programming.

Saki's proprietary, easy-to-use and program software enables programming and debugging off line. This greatly improves the reliability of inspection performance and results, regardless of user skill level. In addition, program corrections can be made in real time without stopping the inspection process.